Chamfered Substrate Side Wiring for Bezel-less Displays

The wiring structure transitions from a two-dimensional planar configuration to a three-dimensional structure that follows the chamfered surface geometry. The side wiring is formed to extend along the inclined chamfered surface rather than remaining flat on the substrate surface, distributing mechanical stress across multiple dimensions and reducing susceptibility to chipping and cracks while maintaining bezel-less display area.

The chamfered surface structure serves as a pre-designed stress distribution mechanism that cushions mechanical shocks and thermal stresses before they can cause damage to the wiring. The inclined surface geometry is formed in advance to redirect and dissipate forces that would otherwise concentrate at sharp edges and cause wiring failure.

The substrate edge geometry is transformed from a simple flat surface to a multi-faceted chamfered structure with inclined surfaces. This dimensional change creates a more robust edge profile that maintains structural integrity while minimizing the visible bezel area, as the chamfered surfaces can be positioned to remain less visible or integrated into the display boundary.

The chamfered surface introduces asymmetric geometry to the substrate edge, creating a tapered profile that is stronger at the base and gradually reduces toward the display area. This asymmetric structure provides enhanced mechanical support where needed while allowing for minimal bezel visibility, resolving the conflict between structural strength and display area maximization.