Semiconductor Channel Hole Inspection via Image Segmentation
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Solution Overview
Problem
Current semiconductor manufacturing processes lack an effective method to accurately inspect channel holes formed during the etching process, which can lead to production yield issues and defects.
Innovation Solution
A method involving the use of an electron microscope to produce a pattern image, enhance boundaries, combine images, and binarize the overlapping image to determine if channel holes are formed normally, utilizing image processing techniques to analyze symmetry and detect abnormalities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional inspection methods are used to inspect channel holes, then the inspection process is simple, but the measurement precision and detection accuracy are insufficient
Solution Approach 1:
The inspection method segments the channel hole image into multiple components: original pattern image, boundary image (extracting first and second boundaries), and overlapping image (combining pattern and boundary images). This segmentation allows precise measurement of channel hole dimensions by analyzing specific features rather than treating the entire image as a single unit, thereby improving measurement precision while managing complexity through structured processing steps.
2Measurement precision
If advanced image processing techniques are applied to enhance boundary detection, then the measurement precision improves, but the processing time and computational complexity increase
Solution Approach 1:
The method performs preliminary actions by first extracting boundary patterns from the channel hole image before combining them with the original pattern. The boundary image is created in advance with enhanced edge information, and the overlapping image is prepared beforehand. This preliminary processing organizes the data structure to facilitate faster final measurement and analysis, reducing overall processing time while maintaining high precision.
3Manufacturing precision
If multiple image processing steps are implemented to ensure manufacturing precision, then the product quality improves, but the productivity decreases due to increased processing complexity
Solution Approach 1:
The method replaces complex manual inspection and multiple sequential processing steps with an automated image processing system that uses electronic image analysis. The computer automatically performs boundary detection, image combination, and measurement calculations, substituting mechanical/manual operations with algorithmic processing. This automation maintains high manufacturing precision through consistent application of processing rules while improving productivity by eliminating manual intervention and reducing processing variability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the accuracy of channel hole inspection, reduces errors, and ensures that semiconductor devices are manufactured to specifications, thereby increasing production yield and quality.
Implementation Method 1
The channel holes are inspected using an electron microscope to produce a pattern image of patterns
Data Source
AI summary
A method of inspecting patterns formed the manufacturing of semiconductor devices or the like includes producing an image of the patterns, producing a boundary image including a plurality of boundary patterns corresponding to first and second boundaries of each of the patterns, combining the pattern image and the boundary image to produce an overlapping image including overlapping patterns in which the patterns fill regions between the boundary patterns, and binarizing the overlapping image to produce a binary image including binary patterns corresponding to the overlapping patterns.