Channel-Forming Substrate With Alternating Grooves for Adhesive Control
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Solution Overview
Problem
Existing channel-forming substrates face challenges in suppressing protrusion of bonding adhesive while maintaining rigidity, as intermittently formed grooves are ineffective in releasing excess adhesive, and continuously formed grooves compromise rigidity.
Innovation Solution
A channel-forming substrate design with alternating, intermittently formed first and second grooves on two substrates surrounding the liquid channel, allowing for effective release of bonding adhesive without compromising rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If continuously forming one groove to surround the liquid channel, then the amount of bonding adhesive that can be released is increased, but the rigidity of the channel-forming substrate is reduced
Solution Approach 1:
The continuous groove is segmented into multiple intermittent grooves arranged alternately on the first and second substrates. This segmentation allows the groove structure to be distributed across multiple components, enabling sufficient adhesive release while preserving the structural integrity and rigidity of each individual substrate.
Solution Approach 2:
The groove structures from the first substrate and second substrate are merged to form a combined groove system that surrounds the liquid channel. By combining the intermittent grooves from both substrates, the system achieves continuous adhesive release coverage while each substrate maintains its structural strength.
2Strength
If intermittently forming a plurality of grooves, then the rigidity of the channel-forming substrate is maintained, but the bonding adhesive cannot be released sufficiently between the grooves
Solution Approach 1:
The groove arrangement is extended to a three-dimensional configuration by forming intermittent grooves on both the first substrate and the second substrate. This dimensional expansion creates multiple release pathways for bonding adhesive from different sides, ensuring sufficient adhesive release while maintaining the rigidity provided by the intermittent groove pattern.
3Reliability
If forming grooves to suppress adhesive protrusion, then bonding adhesive flow into liquid channel is prevented, but the manufacturing complexity increases
Solution Approach 1:
The groove structures are formed on the substrates before bonding the first and second substrates together. This preliminary formation of grooves allows the bonding adhesive to be directed into the grooves during assembly, preventing adhesive protrusion and simplifying the overall manufacturing process by avoiding post-bonding corrections.
Data Source
AI summary
An object is to provide a channel-forming substrate capable of suppressing protrusion of a bonding adhesive while maintaining rigidity. The channel-forming substrate includes a first substrate in which a hollow portion to be a liquid channel is formed and a second substrate bonded to the first substrate with a bonding adhesive, in the first substrate, a plurality of first grooves are intermittently formed in a bonding surface bonded to the second substrate, in the second substrate, a plurality of second grooves are intermittently formed in a bonding surface bonded to the first substrate, and in a case where the channel-forming substrate is viewed from above, the first grooves and the second grooves are arranged alternately so as to surround the hollow portion.