Charge-Dispelling Device for Semiconductor Noise Reduction

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Solution Overview

Problem

Increased device density in semiconductor integrated circuits leads to noise issues, compromising signal integrity and causing data loss or errors, particularly due to improper grounding during manufacturing processes which result in charge accumulation and damage to gate dielectrics.

Innovation Solution

Incorporating a charge-dispelling device connected between the grounds of inverters to create a bypass path for accumulated charges, utilizing a metal line or diodes to dissipate charges and prevent noise interference, thereby reducing the risk of CDM-like damage and maintaining transistor performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If device density is increased in integrated circuits, then production efficiency is improved and costs are lowered, but noise increases and signal integrity is compromised

Engineering Contradiction:

Improveproduction efficiencyVSAvoidnoise

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The invention segments the grounding system by introducing separate charge-dispelling devices for different circuit blocks (logic circuits and RF circuits). Each block has its own dedicated charge-dispelling path to ground, preventing noise coupling between blocks while maintaining high device density. This segmentation allows independent optimization of charge dissipation for each circuit type.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention introduces charge-dispelling devices as intermediary elements between the high-density circuit blocks and ground. These devices act as mediators that safely channel accumulated charges to ground through controlled paths, preventing noise generation while allowing continued device scaling and density increase.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Quantity of substance

If device density is increased, then functional density is improved, but charge accumulation and CDM-like damage occur

Engineering Contradiction:

Improvefunctional densityVSAvoiddevice reliability

Core Design Contradiction:

Quantity of substanceVSReliability

Solution Approach 1:

The invention implements preliminary protective action by pre-configuring charge-dispelling devices and paths during the manufacturing stage, before charge accumulation problems occur. The charge-dispelling devices are integrated into the device structure ahead of time, so when charges accumulate during operation, they can be immediately and safely dissipated through the pre-established paths, preventing CDM-like damage and maintaining high functional density.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The charge-dispelling devices serve as a protective cushioning mechanism that is in place before damage can occur. By providing predetermined charge dissipation paths, the invention cushions against the harmful effects of charge accumulation, allowing higher device density without compromising reliability.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Ease of manufacture

If conventional grounding methods are used in high-density circuits, then manufacturing is simplified, but noise interference and signal integrity issues arise

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidsignal integrity

Core Design Contradiction:

Ease of manufactureVSLoss of information

Solution Approach 1:

The invention applies local quality by providing differentiated grounding solutions for different circuit blocks. Logic circuits and RF circuits each have their own charge-dispelling devices and ground paths tailored to their specific noise characteristics and requirements. This localized approach maintains manufacturing feasibility while significantly improving signal integrity by preventing noise coupling between different circuit types.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The charge-dispelling device effectively dissipates accumulated charges and reduces noise interference, enhancing the integrity and yield of semiconductor devices by preventing damage to gate dielectrics and maintaining consistent transistor performance.

Implementation Method 1

a charge-dispelling device is connected between a ground of the first inverter and a ground of the second inverter to provide a bypass path for charges

Methodology Applied

Scientific EffectElectrical Conduction: Conduction (electrical)

Implementation Method 2

the bypass path is at a same metal level or at a lower metal level than the electrical path between the first inverter and the second inverter

Methodology Applied

Scientific EffectElectrical Current Flow: Conduction (electrical)

Data Source

PatentUS9906224B1Semiconductor device to dispel charges and method forming the same

Publication Date: 2018.02.27 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

The semiconductor device for fabricating an IC is provided. The semiconductor device includes a deep n-well (DNW), a first inverter, a second inverter, an electrical path, and a charge-dispelling device. The DNW is formed in a substrate. The first inverter is formed inside the DNW. The second inverter is formed in the substrate and outside the DNW. The electrical path is arranged between the first inverter and the second inverter. The charge-dispelling device is connected between the ground of the first inverter and the ground of the second inverter to develop a bypass path. The impedance of the bypass path is lower than the impedance of the electrical path.