Charge Drain Coating for MEMS Lenslets in E-Beam Lithography

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Solution Overview

Problem

Electron-optical MEMS components in e-beam lithography systems are prone to electrostatic charging due to electron buildup, which interferes with their operation and reduces throughput, limiting their use to low volume production environments.

Innovation Solution

A charge drain coating is applied to the inner surfaces of MEMS device lenslets, comprising insulating material with embedded nanoclusters, which effectively drains embedded electrons and maintains high dielectric strength to prevent short-circuiting, allowing for uniform electrostatic fields and consistent performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If electron-optical MEMS devices are used to increase throughput in e-beam lithography, then productivity is improved, but electrostatic charging occurs due to electron buildup which interferes with operation and reduces reliability

Engineering Contradiction:
ImprovethroughputVSAvoidoperational stability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

A charge drain coating is applied to the inner surfaces of lenslets to act as an intermediary layer that captures and drains accumulated electrons. This coating includes insulating material with embedded conductive nanoclusters that provide charge dissipation pathways without interfering with the optical function of the lenslets, thereby maintaining reliability while enabling high throughput operation

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The charge drain coating utilizes a porous or composite structure with insulating material containing embedded nanoclusters. This structure allows the coating to maintain high dielectric strength for electrical isolation while providing pathways through the nanoclusters for charge drainage, resolving the contradiction between maintaining operational stability and enabling high productivity

Inventive Principle:
Principle #31Porous materials

2Reliability

If a charge drain coating is applied to drain embedded electrons, then reliability is improved, but the coating must maintain high dielectric strength to prevent short-circuiting which complicates the material composition

Engineering Contradiction:
Improvecharge drainage effectivenessVSAvoidcoating structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The charge drain coating is formed as a composite material combining insulating material with embedded conductive nanoclusters. This composite structure provides dual functionality: the insulating matrix maintains high dielectric strength to prevent short-circuiting, while the embedded nanoclusters provide charge drainage pathways, thereby improving reliability without requiring complex multi-layer structures

Inventive Principle:
Principle #40Composite materials

3Productivity

If conventional e-beam lithography systems are used, then device complexity is low, but productivity is limited to low volume production environments

Engineering Contradiction:
ImprovethroughputVSAvoidsystem complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The charge drainage functionality is extracted as a separate coating layer applied to the lenslet surfaces, rather than being integrated into the lenslet structure itself. This extraction allows the use of standard electron-optical MEMS devices for high throughput while adding charge drainage capability through the separate coating, thereby increasing productivity without significantly increasing overall system complexity

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The charge drain coating enhances the operational efficiency of electron-optical MEMS devices by reducing electrostatic interference, increasing throughput, and extending their lifespan, enabling their use in higher volume production environments.

Implementation Method 1

The electron-optical MEMS component may be subject to electrostatic charging. For example, electrons may become embedded into portions of the electron-optical MEMS component and an electron charge may build up on the electron-optical MEMS component.

Methodology Applied
Scientific EffectElectrostatic charging: Electrostatics

Implementation Method 2

the charge drain coating includes insulating material and at least one doping material embedded within the insulating material. In some embodiments, the doping material includes at least one nanocluster.

Methodology Applied
Scientific EffectCharge drainage through nanoclusters: Conduction (electrical)

Implementation Method 3

each of the lenslets may be configured to either absorb or reflect at least some of the electrons from the electron beam

Methodology Applied
Scientific EffectElectron absorption: Absorption (EM radiation)

Implementation Method 4

each of the lenslets may be configured to either absorb or reflect at least some of the electrons from the electron beam

Methodology Applied
Scientific EffectElectron reflection: Reflection

Data Source

PatentUS10072334B2Digital pattern generator having charge drain coating
Publication Date: 2018.09.11 UCHICAGO ARGONNE LLC
  • US10072334B2 patent drawing
  • US10072334B2 patent drawing
  • US10072334B2 patent drawing

AI summary

A digital pattern generator has a MEMS substrate with a plurality of doping layers and a plurality of insulating layers between respective doping layers. A plurality of lenslets are formed as holes through the substrate. A charge drain coating is applied to the inner surfaces of the lenslets. The charge drain coating drains electrons that come into contact with the charge drain coating so that the performance of the digital pattern generator will not be hindered by electron charge build-up. The charge drain coating includes a doping material that coalesces into clusters that are embedded within a high dielectric insulating material.