Charge Pump Chip Thermal Management via Segmented Dual PCB Architecture
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Solution Overview
Problem
Fast charging technologies generate excessive heat, leading to a poor user experience due to capacity conversion losses in charge pump chips, which shorten the charging time with large currents and slow down the charging speed.
Innovation Solution
An electronic device with a dual circuit board setup and a control component that dynamically switches charge pump chips on both boards to work in a time-sharing mode, forming dispersed heat sources, effectively managing heat and prolonging charging time with large currents while increasing charging speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If fast charging technology is used to increase charging speed, then charging time is reduced, but heat generation increases causing poor user experience
Solution Approach 1:
The charge pump chipset is divided into multiple charge pump chips distributed across two circuit boards. Each chip processes a portion of the charging current, segmenting the heat generation source. This allows the system to maintain fast charging capability while distributing thermal load across multiple smaller heat sources rather than concentrating it in a single chip.
Solution Approach 2:
The patent transitions from a single-circuit-board architecture to a dual-circuit-board architecture with charge pump chips arranged in a polygon configuration. This spatial redistribution across two dimensions (multiple boards and polygon vertices) disperses the heat sources throughout the device structure, improving heat dissipation and reducing localized temperature buildup while maintaining fast charging performance.
2Power
If charge pump chips work simultaneously to increase charging power, then charging speed improves, but heat generation from each chip increases
Solution Approach 1:
The total charging power is segmented across multiple charge pump chips instead of using a single high-power chip. Each chip operates at a lower individual power level, generating less heat per chip, while the cumulative power output maintains fast charging capability. This segmentation allows simultaneous operation of multiple chips with reduced thermal stress on each individual component.
Solution Approach 2:
The patent implements different operational states for different charge pump chips based on temperature conditions. When certain chips exceed temperature thresholds, the control component switches those specific chips to standby while activating others. This localized quality control ensures that each chip operates within optimal temperature ranges while maintaining overall charging power through coordinated operation of multiple chips.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively controls heat generation during charging, optimizing user experience by extending the time for charging with large currents and enhancing fast charging speed, even at high power levels above 100W.
Implementation Method 1
charge pump chips (320, 330) provided on the first circuit board (100), and at least two charge pump chips (310, 340) provided on the second circuit board (200)
Implementation Method 2
one temperature detection device is connected to one charge pump chip, and configured to output a detection signal based on the temperature of the charge pump chip
Data Source
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AI summary
The invention provides an electronic device that includes: a first circuit board, an second circuit board, a charge pump chipset, a battery, and a control component. The second circuit board is provided on the first circuit board. The charge pump chipset includes at least two charge pump chips provided on the first circuit board and at least two charge pump chips provided on the second circuit board. The control component is configured to control one charge pump chip on the first circuit board and at least one charge pump chip on the second circuit board to simultaneously be in a working state, and in response to a temperature of the charge pump chip on the first circuit board in the working state being higher than a set threshold, switch any charge pump chip on the first circuit board with the temperature lower than the set threshold to the working state.