Charge Pump Chip Switching for Fast-Charging Heat Control
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Solution Overview
Problem
Fast charging technologies generate excessive heat in charge pump chips, leading to reduced user experience due to increased temperature and decreased charging speed.
Innovation Solution
A charging control method and apparatus that utilizes multiple charge pump chips on separate circuit boards connected in parallel, with a processor-controlled temperature detection system to dynamically switch chips on and off based on temperature thresholds, distributing heat sources and optimizing charging current to prevent overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If fast charging technology is used to improve charging efficiency, then charging speed is improved, but heat generation of charge pump chip increases
Solution Approach 1:
The charge pump function is segmented across multiple chips distributed on different circuit boards. Instead of using a single charge pump chip, the system employs at least two charge pump chips on the first circuit board and at least two charge pump chips on the second circuit board, dividing the total charging current load among them. This segmentation reduces the heat generation per chip while maintaining overall fast charging capability.
Solution Approach 2:
The patent introduces a spatial dimension by distributing charge pump chips across multiple circuit boards (first circuit board and second circuit board) rather than concentrating them on a single board. This multi-dimensional layout improves heat dissipation by separating heat sources in space, allowing better thermal management while maintaining high charging power.
2Temperature
If multiple charge pump chips are used to reduce heat generation, then temperature control is improved, but device complexity increases
Solution Approach 1:
Multiple charge pump chips are merged into a coordinated system where chips on the first circuit board and second circuit board work together in parallel. The control unit coordinates these chips to share the charging load, achieving better temperature control through combined operation while managing the complexity through centralized control logic.
Solution Approach 2:
The system dynamically adjusts which charge pump chips are active based on temperature conditions. The control unit monitors temperatures of individual chips and dynamically switches chips between working states to optimize thermal performance. This dynamic operation allows the system to adapt to changing thermal conditions and manage complexity through intelligent control rather than fixed architecture.
3Productivity
If charge pump chips operate continuously to maintain fast charging, then charging efficiency is maintained, but overheating occurs
Solution Approach 1:
The control unit implements periodic monitoring of charge pump chip temperatures and dynamically switches chips between active and standby states based on thermal conditions. When a chip's temperature exceeds a threshold, the system periodically switches to alternative chips, creating a rotating operation pattern that maintains continuous charging capability while allowing individual chips to cool down, thus preventing overheating.
Solution Approach 2:
When charge pump chips overheat, the system temporarily discards their active service and switches to alternative chips that are within safe temperature ranges. Once the overheated chips cool down below the threshold, they are recovered and brought back into service. This discarding and recovering strategy ensures continuous fast charging while preventing sustained overheating of any single chip.
Data Source
AI summary
A charging control method and apparatus are provided. The electronic device can include a first circuit board, a second circuit board, and a charge pump chipset. The second circuit board is provided on the first circuit board. The charge pump chipset includes at least two charge pump chips on the first circuit board and at least two charge pump chips on the second circuit board connected in parallel. One charge pump chip on the first circuit board and at least one charge pump chip on the second circuit board are controlled to be in a working state at the same time. In response to a temperature of the charge pump chip in the working state on the first circuit board being higher than a threshold, any charge pump chip on the first circuit board with the temperature lower than the threshold is switched to the working state.