Charge Pump Redundancy for Memory Yield
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Solution Overview
Problem
High defect rates in multi-layer capacitors used in three-dimensional semiconductor integrated circuits lead to a significant percentage of charge pump arrays being defective, failing to provide the target current at the load voltage, which is exacerbated by the high current demands of modern memory devices.
Innovation Solution
Incorporating redundant charge pump arrays and bypass capacitors with modifiable elements like fuse links to enable or disable defective components, ensuring that non-defective arrays can provide the required current, and decoupling defective capacitors from the circuit to maintain functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple charge pump arrays are ganged in parallel to provide higher current capability, then the current output is improved, but the defect rate increases due to higher capacitor requirements
Solution Approach 1:
The patent applies preliminary action by incorporating redundant charge pump arrays and bypass capacitors before defects occur. The redundant arrays are pre-configured with modifiable elements (fuses, anti-fuses) that allow them to be activated later if primary arrays fail, preventing system failure before it happens.
Solution Approach 2:
The patent implements beforehand cushioning by adding redundant charge pump arrays and bypass capacitors as a buffer against component failures. These redundant components are kept in standby with modifiable elements that can be activated to compensate for failed primary components, cushioning the system against defects.
2Power
If higher currents are drawn from charge pump arrays to meet memory device demands, then the power delivery is improved, but the capacitor size and defect risk increase
Solution Approach 1:
The patent applies segmentation by dividing the charge pump system into multiple independent arrays, each with its own bypass capacitors and modifiable elements. This segmentation allows the system to distribute the high current demand across multiple smaller units, reducing the capacitor size and defect risk in each individual array while maintaining overall high power delivery capability.
3Reliability
If redundant charge pump arrays are included to compensate for defects, then the system reliability is improved, but the device complexity increases
Solution Approach 1:
The patent applies merging by combining multiple charge pump arrays with their outputs coupled together through common nodes. The modifiable elements (fuses, anti-fuses) are integrated into the existing circuit paths, allowing redundant arrays to be merged with primary arrays without requiring separate, complex control circuits. When a primary array fails, the redundant array is activated through simple fuse blowing or anti-fuse formation, maintaining reliability while minimizing added complexity.
Data Source
AI summary
An integrated circuit includes a circuit block to utilize a load current at a load voltage from a power input and two or more charge pump arrays. The outputs of the charge pump arrays are coupled to the power input of the circuit block. The integrated circuit includes one or more modifiable elements to disable one or more of the two or more charge pump arrays.