Charged Cleaning Mask for Lithography Particle Capture
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Solution Overview
Problem
The challenge in semiconductor manufacturing is the increase in particle contamination during lithography exposure processes, which leads to reduced wafer yield and increased manufacturing costs due to the inability to accurately pattern smaller features on semiconductor wafers.
Innovation Solution
The implementation of a cleaning mask with a conductive and semiconductive structure, charged by an electrostatic field, is used within the lithography exposure apparatus to attract and capture particles, thereby reducing particle fallout on the photomask and improving wafer yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor features are scaled down to increase functional density, then production efficiency and cost are improved, but manufacturing precision and pattern accuracy deteriorate due to particle contamination
Solution Approach 1:
The cleaning mask is positioned and charged before the lithography exposure process to proactively attract and capture particles in the enclosure. This preliminary action prevents particles from settling on the photomask during exposure, thereby maintaining pattern accuracy while enabling continued scaling for improved productivity
Solution Approach 2:
The cleaning mask serves as an intermediary element between the particle-containing enclosure environment and the sensitive photomask. By introducing this intermediate component with opposite charge, particles are diverted to the cleaning mask rather than the photomask, resolving the contradiction between maintaining precision and achieving high productivity through scaling
2Reliability
If a cleaning mask with conductive and semiconductive structure is charged to attract particles, then particle capture effectiveness is improved, but device complexity increases
Solution Approach 1:
The cleaning mask performs multiple functions: it acts as a particle attractor through its charged surface, serves as a protective barrier during exposure, and can be reused across multiple lithography cycles. This multi-functionality justifies the increased structural complexity by eliminating the need for separate particle removal systems
Solution Approach 2:
The cleaning mask employs a composite structure with both conductive and semiconductive layers. The conductive layer enables effective charging and particle attraction, while the semiconductive layer provides appropriate electrical properties for the application. This composite material approach optimizes particle capture effectiveness while managing the inherent complexity through material selection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively captures particles within the enclosure, enhancing the accuracy and reliability of the patterning process, leading to improved wafer quality and reduced manufacturing time and costs.
Implementation Method 1
charging the cleaning mask to attract charged particles in the enclosure
Data Source
AI summary
A method includes transporting a cleaning mask and a photomask into an enclosure of a lithography exposure apparatus, wherein the photomask includes a multilayered mirror structure, and the cleaning mask is free of the multilayered mirror structure; placing the cleaning mask on a reticle stage of the lithography exposure apparatus; and charging the cleaning mask to attract charged particles in the enclosure.