Charged Particle Beam Device Image Superimposition for Damage-Free Processing

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional charged particle beam devices, such as FIB devices, cause damage to samples during ion beam scanning for image acquisition, leading to inaccurate processing and observation due to differences in scan angles and types of beams used for processing and imaging.

Innovation Solution

A composite charged particle beam device that superimposes images obtained using an ion beam and an electron beam, excluding ion beam-irradiated regions, allowing for precise processing and observation without damaging the sample by using image alignment techniques to match SEM and FIB images.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If ion beam scanning is used to obtain FIB images for specifying processing locations, then precise location specification is achieved, but sample surface damage occurs due to ion sputtering

Engineering Contradiction:

Improvelocation specification precisionVSAvoidsample surface damage

Core Design Contradiction:

Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The patent divides the imaging function into two separate beam systems: ion beam for processing and electron beam for imaging. This segmentation allows each beam type to perform its specialized function without causing harmful effects to the sample, resolving the contradiction between precise location specification and sample damage.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces an electron beam as an intermediary imaging tool that does not cause ion sputtering damage. The electron beam captures images that are then aligned and superimposed with the ion beam processing field of view, enabling precise location specification without direct ion beam imaging.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If electron beam scanning or external image capture is used to specify processing locations, then sample damage is reduced, but image alignment and distortion issues occur due to different scan angles and beam types

Engineering Contradiction:

Improvesample surface damageVSAvoidimage alignment accuracy

Core Design Contradiction:

Object-affected harmful factorsVSMeasurement precision

Solution Approach 1:

The patent implements feedback mechanisms through image alignment processing that compares electron beam images with ion beam field of view data. The system automatically adjusts for scan angle differences and distortion through coordinate transformation and superimposition, ensuring accurate alignment while maintaining the benefit of non-damaging electron beam imaging.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The patent transforms the electron beam image data by adjusting parameters such as scan angle, magnification, and coordinate systems to match the ion beam processing field of view. This parameter transformation enables accurate image alignment despite differences in beam types and scanning conditions.

Inventive Principle:

Principle #35Parameter changes

3Adaptability or versatility

If FIB image and external images are used with different scan angles, then different perspectives can be obtained, but distortions occur unavoidably

Engineering Contradiction:

Improveimaging perspective flexibilityVSAvoidimage distortion

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent applies parameter transformation techniques to correct distortions caused by different scan angles. By adjusting magnification, rotation, and coordinate transformation parameters, the system aligns images from different perspectives while maintaining geometric accuracy for precise processing.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables precise observation and processing of designated locations without ion beam-induced damage, using image superimposition to align and correct for differences in beam types and angles, ensuring accurate representation of sample conditions.

Implementation Method 1

the FIB device refers to a device for causing a phenomenon known as ion sputtering in which atoms in a surface are made to spring out into a vacuum by irradiating a focused ion beam to a site desired to be processed

Methodology Applied

Scientific EffectIon sputtering: Sputtering

Implementation Method 2

use of an SEM image obtained by electron beam scanning or an image captured from the outside to specify a prearranged location to be processed can reduce the possibility of causing damage to a sample

Methodology Applied

Scientific EffectElectron beam scanning: Electron Beam

Data Source

PatentUS8912487B2Charged particle beam device, position specification method used for charged particle beam device, and program

Publication Date: 2014.12.16 HITACHI HIGH TECH CORP

AI summary

Observation using an FIB image is enabled without causing any damage to a designated region. To this end, an ion beam scanning-prohibited region is set in a sample by using an image acquired by a charged particle beam other than an ion beam, or an image prepared as external data as a peripheral image including the designated region of a sample. Thereafter, the image used to set the ion beam scanning-prohibited region is exactly superimposed on an FIB image acquired for regions except the ion beam scanning-prohibited region, thereby forming an image including the ion beam scanning-prohibited region on which ion beam scanning has not been performed.