Charged Particle Microscope Mixed Image Generation
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Solution Overview
Problem
Existing semiconductor wafer inspection methods face challenges in improving the visibility of circuit patterns and defects due to the increasing burden of viewing multiple images from multiple detectors, with existing methods not adequately addressing the need for automatic optimization of image synthesis based on defect or circuit pattern visibility.
Innovation Solution
A method and device using a charged particle microscope with multiple detectors to automatically adjust and mix images by calculating mixing parameters, generating high-resolution mixed images that enhance the visibility of defects and circuit patterns, thereby reducing the user's workload in image analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple detectors are used to detect electrons at different emission angles or energies to improve visibility of defects and circuit patterns, then the visibility of defects and circuit patterns is improved, but the number of images to be viewed increases, laying an increasing burden on users
Solution Approach 1:
The patent combines multiple detector images into a single mixed image by calculating a mixed image from images obtained by multiple detectors arranged at different positions from the sample. This merging process integrates the information from multiple detectors while presenting a unified view to the user, thereby improving defect and circuit pattern visibility without increasing the number of images the user must view separately.
Solution Approach 2:
The patent introduces an image mixing process as an intermediary between multiple detectors and the user. The mixed image calculation unit acts as a mediator that processes the multiple detector images and generates a synthesized mixed image, which then is displayed to the user. This intermediary process resolves the contradiction by transforming multiple separate images into one integrated image that maintains the visibility benefits while eliminating the viewing burden.
2Loss of information
If multiple detectors are used to detect electrons at different emission angles or energies, then information on target irregularities is improved, but the complexity of the device increases
Solution Approach 1:
The patent merges the data from multiple detectors into a single mixed image through automated calculation. By combining the images obtained from multiple detectors arranged at different positions, the system preserves comprehensive information about target irregularities while presenting a unified output, thereby reducing the effective complexity of handling multiple separate images.
Solution Approach 2:
The system performs automated mixed image calculation without requiring user intervention. The mixed image calculation unit automatically processes the multiple detector images and generates the mixed image, making the system self-sufficient in managing the complexity of multiple detectors. This automation reduces the operational complexity burden on users while maintaining the information-gathering capability of multiple detectors.
3Measurement precision
If automatic optimization of image synthesis is implemented for each defect point, then the visibility in defect observation is improved, but the calculation complexity and processing time increase
Solution Approach 1:
The patent calculates the mixed image based on images from multiple detectors in advance, before defect analysis is performed. By pre-processing the multiple detector images into a mixed image, the system prepares optimized visualization data ahead of time, reducing the processing time required during actual defect observation while maintaining improved visibility through the synthesized image.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively outputs highly visible images of defects and circuit patterns, reducing the user's burden in image viewing and improving the efficiency of defect observation in semiconductor manufacturing processes.
Implementation Method 1
causing a plurality of detectors arranged at different positions from the sample to detect a secondary electron or a reflected electron generated from the sample by irradiating and scanning the sample with a charged particle beam
Implementation Method 2
causing a plurality of detectors arranged at different positions from the sample to detect a secondary electron or a reflected electron generated from the sample
Data Source
AI summary
An inspection method uses a charged particle microscope to observe a sample and view a defect site or a circuit pattern. A plurality of images is detected by a plurality of detectors and a mixed image is generated by automatically adjusting and mixing weighting factors required when the plurality of images are synthesized with each other. The sample is irradiated and scanned with a charged particle beam so that the plurality of detectors arranged at different positions from the sample detects a secondary electron or a reflected electron generated from the sample. The mixed image is generated by mixing the plurality of images of the sample with each other for each of the plurality of detectors, which are obtained by causing each of the plurality of detectors arranged at the different positions to detect the secondary electron or the reflected electron. The generated mixed image is displayed on a screen.