Charged Plate Particle Evaluation in Substrate Processing Chambers
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Solution Overview
Problem
Conventional methods struggle to accurately monitor and reduce particles within substrate processing apparatuses to a predetermined level, leading to potential defects in semiconductor devices due to particle adhesion, and existing techniques for particle removal and monitoring are inefficient and time-consuming.
Innovation Solution
An evaluation method involving a charged plate inside the apparatus to accelerate particle adhesion using electrostatic forces, allowing for a rapid assessment of particle levels through a dummy operation, utilizing an acceleration coefficient to estimate particle adhesion frequency and ensure cleanliness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dummy operation is performed for a long time to reduce particles to a predetermined level, then particle cleanliness is improved, but downtime increases and productivity deteriorates
Solution Approach 1:
The patent applies preliminary action by performing a dummy operation before actual substrate processing to proactively reduce particles to a predetermined level. This ensures particle cleanliness is established in advance, preventing defects during subsequent real operations and reducing overall downtime by avoiding interruptions for particle removal during production.
Solution Approach 2:
The patent employs self-service by using a charged substrate within the apparatus itself to attract and remove particles through electrostatic attraction. The substrate acts as both the processing object and the particle removal mechanism, eliminating the need for separate cleaning operations or external cleaning devices.
2Productivity
If a charged substrate is used to attract particles by electrostatic force, then particle removal efficiency is improved, but measurement precision of particle levels deteriorates
Solution Approach 1:
The patent segments the evaluation process into two distinct phases: first performing a dummy operation with a charged substrate to actively remove particles, then performing a separate monitoring operation to precisely measure the remaining particle level. This segmentation allows the charged substrate to maximize particle removal efficiency without interfering with the accuracy of subsequent measurements.
Solution Approach 2:
The patent implements periodic action by alternating between dummy operations (particle removal phase) and monitoring operations (measurement phase). This periodic cycling ensures that particle levels are continuously maintained at predetermined levels while allowing accurate periodic assessment of cleanliness status without the confounding effect of active particle attraction during measurement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and timely evaluation of particle levels within the apparatus, reducing downtime and ensuring the apparatus is operational with improved accuracy and efficiency in maintaining cleanliness.
Implementation Method 1
arranging a plate in a charged state inside the apparatus and obtaining the number of particles adhered to the plate by performing a dummy operation
Data Source
AI summary
The present invention provides an evaluation method for evaluating a state in an apparatus concerning particles existing inside a substrate processing apparatus for processing a substrate, including arranging a plate in a charged state inside the apparatus and obtaining the number of particles adhered to the plate by performing a dummy operation different from an operation of processing the substrate, and evaluating the state in the apparatus based on a coefficient representing a ratio of the number of particles adhered to the plate by performing the dummy operation for the plate in an uncharged state to the number of particles adhered to the plate in the charged state, and the number of particles obtained in the arranging the plate.