On-Board Charger FET Substrate Layout for Compact EV Assembly
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Solution Overview
Problem
Through-hole FETs in on-board chargers for electric vehicles have complex assembly processes, high costs, and large volume, which conflict with the requirements for lightweight and cost-effective design.
Innovation Solution
The use of a field effect transistor (FET) with its pin attached to a conductive substrate instead of through-hole technology, eliminating the need for insulating thermal-conductive materials, simplifying assembly, and ensuring effective cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through-hole FETs are used in on-board chargers, then reliable electrical connection is achieved, but assembly process becomes complex and cost increases
Solution Approach 1:
The patent extracts the FET from the traditional through-hole mounting structure and repositions it to be directly mounted on the heat dissipation substrate. This eliminates the need for separate insulating plates and complex through-hole assembly processes, thereby simplifying the assembly process while maintaining reliable electrical connection through the substrate's conductive structure.
Solution Approach 2:
The patent merges the electrical connection function and heat dissipation function into a single integrated substrate structure. The substrate simultaneously serves as the mounting platform for the FET, the thermal management component, and the electrical connection medium, eliminating the need for separate insulating thermal-conductive materials and reducing assembly complexity.
2Temperature
If through-hole FETs with insulating thermal-conductive materials are used, then effective cooling is achieved, but device volume increases
Solution Approach 1:
The patent combines the heat dissipation substrate and the electrical connection substrate into a single integrated structure. This eliminates the need for separate insulating thermal-conductive materials and reduces the overall volume of the on-board charger while maintaining effective cooling of the FET through the substrate's thermal conductivity.
Solution Approach 2:
The substrate is designed to perform multiple functions simultaneously: it serves as the mounting platform for the FET, provides thermal management through its heat dissipation capabilities, and establishes electrical connections. This multi-functionality reduces the number of separate components needed and minimizes the overall device volume.
3Reliability
If through-hole FET mounting method is used, then stable electrical connection is achieved, but manufacturing cost increases
Solution Approach 1:
The patent removes the need for separate insulating thermal-conductive materials from the assembly process. By designing the substrate to inherently provide both electrical connection and thermal management functions, the manufacturing process is simplified and material costs are reduced while maintaining stable electrical connection.
Solution Approach 2:
The patent changes the structural parameters of the substrate to enable it to perform multiple functions. By adjusting the substrate's conductivity, thickness, and mounting structure, it achieves stable electrical connection without requiring additional insulating materials, thereby reducing manufacturing cost.
4Temperature
If traditional FET arrangement is used, then adequate cooling space is provided, but space utilization efficiency decreases
Solution Approach 1:
The patent merges the heat dissipation function directly into the electrical connection substrate. This integration allows for more compact arrangement of components and improves space utilization efficiency while maintaining adequate cooling space through the substrate's thermal management capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces process costs, enables a miniaturized and lightweight layout, with improved space utilization efficiency and electromagnetic compatibility, enhancing the overall design of the on-board charger.
Implementation Method 1
The pin of the FET is attached to a surface of the conductive substrate. The FET is electrically connected to the conductive substrate.
Data Source
AI summary
An on-board charge and a vehicle are provided. The on-board charger includes a main power board, a power module assembly, and a connecting member. The power module assembly includes a conductive substrate and a field effect transistor (FET). The FET includes an FET body and a pin, the pin of the FET is attached to a surface of the conductive substrate, and the FET is electrically connected to the conductive substrate. The connecting member includes a connecting-member body attached to the conductive substrate, a first pin, and a second pin. One end of the first pin is electrically connected to the connecting-member body and the other end of the first pin is electrically connected to the conductive substrate, and one end of the second pin is electrically connected to the connecting-member body and the other end of the second pin is electrically connected to the main power board.