Chassis Air Cooling Ducting for Electronic Module Thermal Management
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Solution Overview
Problem
Off-the-shelf electronic components used in harsh environments often fail due to elevated operating temperatures, as they are not well-suited for high ambient temperatures, leading to reduced module lifespan or failure.
Innovation Solution
An air-cooling system with a duct assembly and high-velocity fans is integrated into a chassis, directing cooling airflow over heatsinks on modular electronic components, with fan activation controlled by thermal sensors to manage temperature effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If off-the-shelf electronic components are used in harsh environments, then production and maintenance costs are reduced, but the components fail due to elevated operating temperatures
Solution Approach 1:
The system segments the cooling function by providing individual cooling control for each module through separate duct assemblies and fans, allowing targeted temperature management for each electronic component while using standard off-the-shelf parts
Solution Approach 2:
The duct assembly acts as an intermediary structure that channels cooling air from fans through air passageways to specific modules, enabling effective heat removal from off-the-shelf components without requiring custom-designed temperature-resistant components
2Temperature
If ambient air temperature rises above maximum rated operating temperature, then heat removal capacity is insufficient, but electronic components reach core temperatures above maximum operating limits
Solution Approach 1:
The system performs preliminary cooling action by directing high-velocity air flow over heat sinks before components overheat, with thermal sensors detecting temperature rises and activating fans proactively to prevent core temperatures from exceeding maximum limits
Solution Approach 2:
The cooling system dynamically adjusts to temperature conditions through thermal sensors that monitor component temperature and control fan activation, allowing the system to adapt its cooling capacity to match actual thermal conditions and maintain component safety
3Temperature
If only a small amount of heat is expected to be removed from the module, then maximum ambient internal operating temperature is kept low, but the cooling capacity is insufficient for high-temperature environments
Solution Approach 1:
The system changes the cooling parameters by using high-velocity air flow generated by dedicated fans directed through duct assemblies, dramatically increasing the heat removal capacity from modules to handle high-temperature ambient environments effectively
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The air-cooling system efficiently removes heat from electronic modules, extending their operational life and preventing failure in high-temperature environments by actively managing temperature through controlled airflow.
Implementation Method 1
heatsinks configured to expel heat emitted by the electronic components
Implementation Method 2
flows over at least portions of the exterior surface of the docked electronic modules, including over the heat sinks, to efficiently and effectively remove heat from the modules
Implementation Method 3
directing cooling airflow over heatsinks on modular electronic components, with fan activation controlled by thermal sensors
Data Source
AI summary
A system for providing cooling to electronic modules received within a chassis. The chassis includes a cooling apparatus having ducting and a plurality of fans coupled to the ducting. The ducting includes air passageways that extend through the ducting and are configured to direct air blown into the passageways by the fans toward the modules installed in the chassis. The modules include heat sinks and the air passageways direct the air toward the fins to provide cooling to the heat sinks. The chassis includes switches coupled to the fans and configured to selectively activate the individual fans when the electronic modules are installed in the chassis.