Chassis Air Inlet for External Component Cooling
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Solution Overview
Problem
Information handling systems face challenges in cooling external components, as the internal cooling systems within the chassis are insufficient for external components, limiting their operational capacity and hindering the expansion of computing devices due to space constraints.
Innovation Solution
An information handling system with a chassis that includes an air inlet and a forced convection device to generate airflow, which draws air past external components mounted on the chassis, effectively cooling them through the use of airflow channels and heat dissipation structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If components are mounted externally to the chassis, then the functionality of the computing device is expanded, but the internal cooling system becomes insufficient to cool the external components
Solution Approach 1:
The internal cooling system is designed to serve dual purposes: cooling internal components and cooling external components mounted on the chassis outer surface. The forced convection device generates airflow that passes through air inlets in the chassis, creating a cooling flow path that can accommodate both internal and external component cooling needs, thereby eliminating the requirement for separate cooling systems.
2Reliability
If a separate external cooling system is provided for external components, then the cooling effectiveness is improved, but the device complexity and space requirements increase
Solution Approach 1:
The cooling system for external components is merged with the internal cooling system. The forced convection device, air inlets, and airflow generation mechanism are shared resources that serve both internal and external components, reducing overall system complexity and eliminating redundant cooling infrastructure.
Solution Approach 2:
The internal cooling system is designed to perform multiple functions by directing airflow to both internal components and external components mounted on the chassis, thereby eliminating the need for separate cooling systems and reducing overall device complexity.
3Volume of moving object
If the chassis size is reduced, then the portability and compactness are improved, but the space available for mounting external components is reduced
Solution Approach 1:
The chassis design utilizes the outer surface dimension for mounting external components, rather than relying solely on internal volume. By providing mounting features on the external surface and directing cooling airflow from the interior to the exterior, the system enables component expansion in a different spatial dimension, effectively increasing mounting capacity without increasing chassis volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the efficient cooling of external components, allowing them to operate at full capacity while expanding the functionality of computing devices without the need for separate external cooling systems, thus addressing the space and cooling limitations.
Implementation Method 1
a forced convection device located in the chassis housing and configured to generate an airflow through chassis housing, wherein the generation of the airflow by the forced convection device draws air past the external component and through the air inlet to cool the external component
Data Source
AI summary
An externally mounted component cooling system includes a chassis defining a chassis housing and including an outer surface that is located opposite the chassis from the chassis housing. An air inlet is defined by the chassis and extends through the chassis from the outer surface to the chassis housing. At least one external component mounting feature is included on the outer surface of the chassis adjacent the air inlet. An external component is coupled to the at least one external component mounting feature. A forced convection device is located in the chassis housing and is configured to generate an airflow through chassis housing. The generation of the airflow by the forced convection device draws air past the external component and through the air inlet to cool the external component.