Communication Chassis Heat Dissipation via Integrated Heat Pipes

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Solution Overview

Problem

Conventional communication chassis suffer from poor heat dissipation, leading to uneven temperature distribution, potential equipment damage, and reduced service life due to low heat conductivity and lack of effective heat transfer mechanisms.

Innovation Solution

The implementation of a heat dissipation arrangement that includes a chassis body divided into heat receiving and dissipation portions, connected by first heat pipes, and a thermal module with second heat pipes extending to radiating fins for efficient heat transfer and dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional casting techniques are used to manufacture the communication chassis, then the chassis can be produced with simple structure, but the heat conductivity remains low causing poor heat dissipation

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidheat dissipation performance

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The patent applies composite materials by integrating heat-conducting elements (such as heat pipes or thermally conductive fillers) into the metal chassis material. This creates a composite structure that maintains the simplicity of conventional casting while significantly improving heat conductivity and dissipation performance throughout the chassis body.

Inventive Principle:

Principle #40Composite materials

2Temperature

If the internal space of the communication chassis is enlarged to improve heat dissipation, then heat dissipation performance is improved, but the chassis becomes bulky and heavy

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidchassis weight

Core Design Contradiction:

TemperatureVSWeight of moving object

Solution Approach 1:

The patent applies local quality by concentrating heat-dissipating structures (such as heat-conducting elements and radiating fins) in specific high-heat-generation areas of the chassis rather than uniformly distributing them throughout. This allows effective heat dissipation from critical components without requiring the entire chassis to be enlarged, thus avoiding increased weight and bulk.

Inventive Principle:

Principle #3Local quality

3Temperature

If heat-conducting elements are added to improve heat transfer, then heat dissipation performance is improved, but the device complexity increases

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidstructural complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent applies merging by integrating heat-conducting elements directly into the chassis structure itself, making the chassis body serve dual functions as both structural support and heat transfer medium. This combination reduces the need for separate, additional heat dissipation components and simplifies the overall device structure while maintaining effective heat transfer.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This arrangement enhances heat dissipation performance, maintains stable communication signal quality, and extends the service life of communication equipment by providing additional heat dissipating area and efficient heat transfer mechanisms.

Implementation Method 1

A first heat pipe set is installed on the chassis body and located in the receiving space to extend between and connect to the heat receiving portion and the heat dissipation portion, so that heat absorbed by the heat receiving portion can be transferred to the heat dissipation portion

Methodology Applied

Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

The second heat pipe connects the chassis body to the radiating fins, so that heat transferred to the chassis body is brought by the second heat pipe to the thermal module for dissipation

Methodology Applied

Scientific EffectHeat pipe: Heat Pipe

Implementation Method 3

The thermal module includes a plurality of radiating fins and at least one second heat pipe. The second heat pipe connects the chassis body to the radiating fins, so that heat transferred to the chassis body is brought by the second heat pipe to the thermal module for dissipation

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 4

The radiating fins on the chassis body 10 can be radiated from the radiating fins 103 on the chassis body 10 to dissipate outward

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS7885071B2Heat dissipation arrangement for communication chassis

Publication Date: 2011.02.08 ASIA VITAL COMPONENTS CO LTD

AI summary

A heat dissipation arrangement for communication chassis includes a chassis body defining an inner receiving space and being divided into at least one heat receiving portion and at least one heat dissipation portion; a first heat pipe set arranged in the receiving space to connect the heat receiving portion to the heat dissipation portion, so that heat absorbed by the heat receiving portion can be quickly transferred via the first heat pipe set to the heat dissipation portion; and at least one thermal module including a plurality of radiating fins and at least one second heat pipe, which is connected to the heat dissipation portion and extended through the radiating fins, allowing part of the heat transferred to the heat dissipation portion to be transferred to the radiating fins. The thermal module provides additional heat dissipating area, so that the communication chassis can provide excellent heat dissipation effect.