Chassis Base Integrating Liquid Cooling for Mobile Devices
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Solution Overview
Problem
Mobile computing devices face space constraints for cooling elements, as larger cooling solutions occupy internal chassis space, limiting room for other essential components.
Innovation Solution
A computing device chassis with an internal cavity housing a liquid-cooled cooling element and thermal interfaces, such as a water plate, allows for efficient heat transfer from die packages to the cooling element, freeing up space for other components by integrating the cooling solution within the chassis base.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a liquid-cooled cooling element is used, then heat dissipation performance is improved, but the volume occupied by the cooling element increases
Solution Approach 1:
The cooling element is nested within the chassis base structure. The chassis base contains an internal cavity that houses the liquid-cooled cooling element, effectively nesting the cooling system within the existing device architecture rather than adding it as a separate external component.
Solution Approach 2:
The chassis base serves multiple functions: it provides structural support for the device and simultaneously houses the cooling element. This multi-functionality eliminates the need for a separate dedicated cooling housing, thereby reducing the additional volume required for cooling.
2Temperature
If a cooling element is added to the device, then heat dissipation capability is improved, but the internal chassis space available for other components is reduced
Solution Approach 1:
The cooling element is merged with the chassis base structure. By integrating the cooling system into the chassis base, the patent combines two previously separate functions (structural support and cooling) into a single unified component, thereby eliminating the space conflict between cooling elements and other internal components.
Solution Approach 2:
The cooling element is nested within the chassis base's internal cavity, allowing the cooling system to occupy space that would otherwise be unused or structural, rather than competing for space with functional components.
3Temperature
If thermal interfaces are integrated into the chassis base, then heat transfer efficiency is improved, but the manufacturing complexity increases
Solution Approach 1:
The thermal interfaces are merged with the chassis base structure, forming an integrated assembly where the chassis base simultaneously provides mechanical support and thermal coupling pathways to the cooling element, reducing the number of separate components that need to be manufactured and assembled.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat from processors and GPUs while optimizing internal space, allowing for improved airflow and accommodation of additional components within mobile devices.
Implementation Method 1
transfer and dissipate heat generated by various components
Implementation Method 2
fluid-cooled systems (e.g., water-cooled systems)
Implementation Method 3
thermally coupled to one or more die packages via one or more portions of thermal interface material
Data Source
AI summary
A computing device chassis for a common cooling solution for die packages comprising: a chassis base comprising: an internal cavity; a cooling element housed in the internal cavity; and one or more thermal interfaces to the cooling element.