Chassis IO Enclosure Seal for Water Ingress Protection
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Solution Overview
Problem
Computing devices deployed in harsh environments, such as industrial factories and oil rigs, face challenges with water ingress protection, as existing solutions are not adequately rated for preventing water ingress, and custom printed circuit assemblies can be economically unfeasible.
Innovation Solution
A chassis design with an IO enclosure and sealant that attaches to the chassis body to create a watertight seal, allowing cabling access while preventing water ingress, and incorporating features like cabling glands and conduits to enhance protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing chassis designs are used in harsh environments, then device deployment is simple, but water ingress protection is inadequate
Solution Approach 1:
The chassis is divided into separate functional modules: a main chassis body housing the circuit board, and a detachable IO enclosure containing input-output ports. This segmentation allows each module to be optimized independently - the main chassis provides structural protection while the IO enclosure can be sealed to prevent water ingress at cable access points, resolving the contradiction between protection reliability and structural complexity.
Solution Approach 2:
A sealant material is introduced as an intermediary substance between the IO enclosure and chassis body to create a watertight seal. This mediator fills gaps and crevices at the interface, preventing water ingress without requiring complete redesign of the chassis structure, thus improving water protection while maintaining manufacturing simplicity.
2Reliability
If custom printed circuit assemblies are used to achieve water protection, then water ingress prevention is improved, but manufacturing cost increases
Solution Approach 1:
The patent employs inexpensive sealing components such as grommets, seals, and adhesive tapes at cable access points instead of expensive custom waterproof PCB assemblies. These simple, readily available components provide effective water protection at minimal cost, resolving the contradiction between reliability and manufacturing cost.
Solution Approach 2:
Flexible sealing materials and thin film barriers are used to create waterproof barriers at IO openings and cable penetrations. These thin, adaptable sealing layers conform to various shapes and provide effective water protection without requiring costly custom circuit board design and manufacturing.
3Reliability
If IO ports are sealed to prevent water ingress, then water protection is improved, but cabling access becomes difficult
Solution Approach 1:
The IO enclosure is designed with dynamic sealing mechanisms including removable covers and flexible grommets that can be opened during installation/cabling and sealed during operation. This allows the system to transition between accessible and protected states, resolving the contradiction between water protection and cabling ease of operation.
Solution Approach 2:
Sealing is applied locally at specific critical points such as cable access openings and port interfaces rather than sealing the entire chassis. This localized approach prevents water ingress where it matters most while leaving other areas accessible for cabling operations, balancing protection and operational ease.
Data Source
AI summary
Example implementations relate a chassis for a circuit assembly. The chassis includes a chassis body defining an access opening and a volume to house the circuit assembly including a circuit module and an input-output (IO) unit. The chassis body houses the circuit assembly such that the circuit module is enclosed within the volume defined by the chassis body and the IO unit remains accessible for cabling at the access opening. The chassis further includes an IO enclosure attached to the chassis body to seal the access opening from surrounding environment, where the IO enclosure includes a cabling port to allow the cabling to the IO unit.