Chassis Liquid Cooling Blocks for High-Power Storage Devices
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Solution Overview
Problem
Existing air-based cooling systems are inadequate for efficiently cooling high-power storage devices, leading to heat soak and potential throttling or shutdown, especially in servers with multiple storage devices.
Innovation Solution
Implementing a liquid cooling system within the chassis, using thermally conductive metal blocks with built-in liquid cooling channels to remove heat from storage devices, while maintaining air cooling for other components and adjusting cooling allocations based on device power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air-based cooling is used for storage devices, then the cooling system is simple and easy to implement, but the cooling capability is insufficient for high-power storage devices
Solution Approach 1:
The patent applies liquid cooling (hydraulic principle) by introducing a liquid cooling device with cooling channels that circulate coolant to remove heat from high-power storage devices. The liquid cooling device includes a pump, radiator, and cooling channels formed in the chassis, enabling efficient heat dissipation through fluid circulation rather than air-based cooling.
2Temperature
If liquid cooling is implemented for all components, then cooling capability is sufficient, but other components may be over-cooled and air cooling is wasted
Solution Approach 1:
The patent implements selective cooling by applying liquid cooling only to high-power storage devices that generate excessive heat, while other components continue to use air cooling. The liquid cooling device is positioned to target specific heat-generating components, ensuring cooling resources are allocated efficiently based on actual thermal needs of different components.
3Quantity of substance
If multiple storage devices are installed in a server, then storage capacity increases, but heat soak occurs and causes throttling or shutdown
Solution Approach 1:
The patent introduces liquid coolant as an intermediary heat transfer medium between the storage devices and the external environment. The coolant circulates through cooling channels in the chassis, absorbing heat from multiple storage devices and transporting it to a radiator for dissipation, preventing heat accumulation and thermal throttling.
4Temperature
If cooling allocation is fixed, then system control is simple, but cooling capacity cannot be optimized based on device power consumption
Solution Approach 1:
The patent implements dynamic cooling control where the liquid cooling system can adjust cooling allocation based on the power consumption and thermal needs of individual storage devices. The system dynamically routes coolant flow and adjusts cooling capacity to match actual heat generation, optimizing thermal management while adapting to changing operational conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively dissipates heat from high-power storage devices without overheating other components, ensuring stable operation and easy replacement of storage devices, while optimizing cooling capacity based on demand.
Implementation Method 1
thermally conductive metal blocks with built-in liquid cooling channels to remove heat from storage devices
Implementation Method 2
liquid cooling channels to remove heat from storage devices
Data Source
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AI summary
A chassis (305) may include a member (310). The member (310) may include a system channel (325) for a liquid coolant to flow and a slot (315) in the member (310) for a storage device (120). A liquid cooling block (320) may be associated with the slot (315) in the member (310). The liquid cooling block (320) may include a block channel (405) for the liquid coolant to flow to remove heat from the storage device (120).