Chassis Partition Framework for Personal Cluster Computers

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Solution Overview

Problem

The existing chassis architecture for personal cluster computers faces issues with heat dissipation, noise generation, improper space arrangement, and limited expansibility, particularly due to narrow airflow channels and unsmooth surfaces, which lead to mechanical interferences and instability in configuring components like power distribution boards and graphic cards.

Innovation Solution

The proposed chassis partition framework includes a top chamber for the head-node mainboard, left and right chambers for compute-node mainboards, a middle partition board for alignment, and openable side-doors, comb rail sets, and dual-board cases to create larger airflow channels, facilitate better component placement, and enhance expansion capabilities by allowing for the configuration of larger fans and additional components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If narrow split spaces are used to accommodate mainboards, then component density is improved, but heat dissipation capability deteriorates

Engineering Contradiction:
Improvecomponent densityVSAvoidheat dissipation capability
Core Design Contradiction:
Quantity of substanceVSTemperature

Solution Approach 1:

The chassis is divided into multiple chambers (first chamber for head-node mainboard, second chamber for compute-node mainboards, third chamber for storage devices, fourth chamber for power supply and fans) using partition boards. This segmentation allows each chamber to have optimized airflow paths and spacing, improving heat dissipation while maintaining component density through vertical stacking and face-to-face alignment configurations.

Inventive Principle:
Principle #1Segmentation

2Area of stationary object

If mainboards are configured along the airflow path in split spaces, then space utilization is improved, but noise generation deteriorates

Engineering Contradiction:
Improvespace utilizationVSAvoidnoise generation
Core Design Contradiction:
Area of stationary objectVSObject-generated harmful factors

Solution Approach 1:

The mainboards are configured in a vertical dimension with face-to-face alignment between compute-node mainboards, rather than horizontal placement along the airflow path. This vertical stacking with proper spacing creates larger effective airflow channels while reducing turbulence and wind noise, maintaining high space utilization through the vertical arrangement.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Force

If smaller fans with high rotation speeds are used to maintain airflow pressure, then airflow performance is improved, but operation noise deteriorates

Engineering Contradiction:
Improveairflow pressureVSAvoidoperation noise
Core Design Contradiction:
ForceVSObject-generated harmful factors

Solution Approach 1:

The fan system is segmented into multiple fans distributed across different chambers (front fans in the second chamber, back fans in the fourth chamber, top fans in the first chamber) rather than relying on a single high-speed fan. This distribution allows each fan to operate at lower speeds while collectively maintaining the required airflow pressure, significantly reducing operation noise.

Inventive Principle:
Principle #1Segmentation

4Adaptability or versatility

If independent function modules are configured in limited surplus positions, then functional completeness is improved, but space arrangement deteriorates

Engineering Contradiction:
Improvefunctional completenessVSAvoidspace arrangement
Core Design Contradiction:
Adaptability or versatilityVSEase of operation

Solution Approach 1:

The partition boards serve multiple functions: they separate different functional chambers, provide mounting surfaces for various modules (storage devices, power supply, fans, control boards), and create structural support for the mainboards. This multi-functionality allows all necessary function modules to be integrated into the chassis structure without requiring additional surplus positions, achieving both functional completeness and optimized space arrangement.

Inventive Principle:
Principle #6Universality (Multi-functionality)

5Adaptability or versatility

If riser card architecture is used for graphic card implementation, then expansion capability is improved, but mechanical interference and fastening issues deteriorate

Engineering Contradiction:
Improveexpansion capabilityVSAvoidmechanical interference and fastening issues
Core Design Contradiction:
Adaptability or versatilityVSEase of operation

Solution Approach 1:

The graphic card is nested within the head-node mainboard chamber, mounted on the head-node mainboard with proper spacing and support structures. This nested configuration provides sufficient room for graphic card installation, cable routing, and fastening without mechanical interference from other components, while maintaining expansion capability through the standardized mainboard interface.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design improves heat dissipation and reduces noise while providing a more efficient space arrangement, enabling better airflow and reducing mechanical interferences, thus enhancing the overall performance and expansibility of the personal cluster computer system.

Implementation Method 1

The airflows sucked-in from the front side of the chassis 10 will first flow into each of the split spaces, then pass the main fans 13 and eventually flow out through the rear side of the chassis 10

Methodology Applied
Scientific EffectAirflow generation: Fan

Implementation Method 2

to facilitate the airflows 14 with required flow rate and reach enough wind pressure to flow in/out all the tiny channels between each of the heat fins 110

Methodology Applied
Scientific EffectConvection heat transfer: Convection

Data Source

PatentUS7710731B2Chassis partition framework for personal cluster computer
Publication Date: 2010.05.04 MITAC INT CORP
  • US7710731B2 patent drawing
  • US7710731B2 patent drawing
  • US7710731B2 patent drawing

AI summary

A chassis partition framework is provided for configuring a personal cluster computer that has a head-node mainboard, a first compute-node mainboard, a second compute-node mainboard, a third compute-node mainboard and a fourth compute-node mainboard. The chassis partition framework mainly includes a top chamber, a left chamber and a right chamber. The top chamber is for configuring the head-node mainboard horizontally. The left and right chambers located under the top chamber are for vertically configuring the first and second compute-node mainboards and the third and fourth compute-node mainboards respectively in face-to-face alignment, with the second and third compute-node mainboards standing in back-to-back alignment. Therefore, the mechanical problems of the conventional blade-type personal cluster computer about heat-dissipation, noise-reduction, expansibility and space-arrangement may be improved through the chassis partition framework.