Chassis Serpentine Fluid Path for Aircraft Thermal Management
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Solution Overview
Problem
The increasing heat generation from high-density, smaller electronic components in aircraft-mounted circuit cards poses a challenge for thermal management, as existing cooling systems struggle to efficiently dissipate heat within the limited space of aircraft chassis, potentially damaging components and reducing their reliability.
Innovation Solution
A chassis design incorporating a thermal transfer fluid path that flows in a serpentine pattern through top and bottom rails, allowing for effective heat transfer from electronic components to a thermal transfer fluid, which is then discharged, thereby managing heat and extending the lifespan of both the components and the chassis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If electronic components are made smaller and more densely packed to increase power density, then the power and functionality are improved, but heat generation increases and thermal management becomes more difficult
Solution Approach 1:
The patent uses a liquid thermal transfer fluid flowing through serpentine passages in the chassis to transfer heat from circuit cards. The fluid pathway is integrated directly into the chassis structure, allowing efficient heat removal from high-density electronic components without requiring additional active cooling systems.
2Volume of moving object
If circuit cards are stacked in a chassis to save space on aircraft, then space utilization is improved, but heat dissipation becomes more challenging
Solution Approach 1:
The chassis structure is merged with the thermal management system by integrating serpentine fluid passages directly into the chassis rails. This combination allows the chassis to simultaneously serve as both the mechanical support structure for stacked circuit cards and as the heat transfer pathway, eliminating the need for separate cooling components.
Solution Approach 2:
A thermal transfer fluid acts as an intermediary substance between the heat-generating circuit cards and the ambient environment. The fluid absorbs heat from the circuit cards through the chassis walls and transports it to designated discharge points, enabling efficient heat removal from the compact stacked configuration.
3Device complexity
If traditional air cooling systems are used in chassis, then the system complexity is reduced, but heat dissipation efficiency becomes insufficient for high-density components
Solution Approach 1:
The patent replaces air cooling with a liquid thermal transfer fluid system that flows through serpentine passages in the chassis. This hydraulic approach provides superior heat transfer efficiency compared to air cooling, enabling reliable thermal management for high-density electronic components while maintaining a relatively simple integrated chassis design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation and management, improving the reliability and longevity of electronic components by directly transferring heat from circuit cards to the thermal transfer fluid, even in applications where air cooling is insufficient or not feasible, while maintaining a compact and lightweight structure.
Implementation Method 1
transferring heat from an electronic component on a circuit card held in the chassis and into the thermal transfer fluid flowing through the thermal transfer fluid path
Implementation Method 2
flowing the thermal transfer fluid in a serpentine pattern through the thermal transfer fluid path
Data Source
AI summary
A chassis includes top rails extending along a top side of the chassis, bottom rails extending along a bottom side of the chassis, a fluid inlet connected to the chassis that is configured to receive a thermal transfer fluid, and a fluid outlet connected to the chassis that is configured to discharge the thermal transfer fluid. The chassis further includes a thermal transfer fluid path extending between and fluidly coupled to the fluid inlet and the fluid outlet, wherein the thermal transfer fluid is configured to flow through the thermal transfer fluid path, and wherein the thermal transfer fluid path extends in a serpentine pattern through at least one of the top rails and through at least one of the bottom rails.