Chassis Ventilation Holes for EMI Shielding and Thermal Airflow

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Computing systems face a challenge in balancing electromagnetic interference (EMI) shielding and ventilation for cooling, as reducing ventilation hole density for EMI shielding can lead to insufficient cooling, while increasing it for cooling can result in inadequate EMI shielding, especially in high-power desktop systems operating near Wi-Fi frequency bands.

Innovation Solution

The design of a metal chassis with thicker ventilation holes or alternating positive and negative cross-pattern ventilation holes near the Wi-Fi antenna provides enhanced EMI shielding while maintaining sufficient airflow, using existing manufacturing processes and tooling to minimize additional costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If ventilation hole density is reduced for EMI shielding, then EMI shielding effectiveness is improved, but cooling performance deteriorates

Engineering Contradiction:

ImproveEMI shielding effectivenessVSAvoidcooling performance

Core Design Contradiction:

Object-affected harmful factorsVSTemperature

Solution Approach 1:

The patent applies local quality by creating different ventilation hole patterns in different regions of the chassis. Specifically, a first pattern of ventilation holes is provided in a first region while a second pattern is provided in a second region, with each pattern optimized for its local EMI shielding requirements. This allows the chassis to achieve adequate EMI shielding overall while maintaining sufficient cooling airflow through strategically placed ventilation openings.

Inventive Principle:

Principle #3Local quality

2Temperature

If ventilation hole density is increased for cooling, then cooling performance is improved, but EMI shielding effectiveness deteriorates

Engineering Contradiction:

Improvecooling performanceVSAvoidEMI shielding effectiveness

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent implements local quality by providing region-specific ventilation hole patterns where the first region has a pattern optimized for EMI shielding while the second region has a pattern optimized for cooling airflow. This spatial differentiation allows the system to achieve both adequate EMI shielding and sufficient cooling performance simultaneously, rather than requiring uniform hole distribution throughout the entire chassis.

Inventive Principle:

Principle #3Local quality

3Object-affected harmful factors

If thicker ventilation holes are used for EMI shielding, then EMI shielding effectiveness is improved, but manufacturing complexity increases

Engineering Contradiction:

ImproveEMI shielding effectivenessVSAvoidmanufacturing complexity

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent applies segmentation by dividing the chassis into multiple regions with different ventilation hole patterns. This allows the EMI shielding function to be distributed across multiple smaller patterns rather than requiring a single thick uniform structure. The segmented approach maintains EMI shielding effectiveness while using standard thickness materials that are easier to manufacture with existing processes.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution achieves at least 10 dB higher EMI shielding effectiveness and adequate ventilation, supporting increased processor performance and cooling needs without significant cost or weight increases, and is scalable for future higher DDR and I/O speeds.

Implementation Method 1

the first plurality of ventilation holes having a first thickness, the second plurality of ventilation holes having a second thickness, the first thickness greater than the second thickness

Methodology Applied

Scientific EffectElectromagnetic wave blocking: Absorption (EM radiation)

Data Source

PatentUS20220394884A1Computing system chassis design for noise isolation and thermal airflow

Publication Date: 2022.12.08 INTEL CORP

AI summary

In some embodiments, a computer system chassis comprises a chassis side having an antenna portion and a fan portion. The antenna portion is located closer to an antenna located on an external surface of the chassis side than the fan portion. The antenna and fan portions comprise ventilation holes that provide for the venting of heated air from the chassis interior to the surrounding environment. In some embodiments, the ventilation holes in the antenna portion are thicker than the ventilation holes in the fan portion. The thicker ventilation holes provide an adequate level of EMI shielding for the antenna from platform noise generated by components (CPUs, GPUs, memories, etc.) located in the chassis interior. In other embodiments, the antenna portion comprises alternating positive and negative cross pattern ventilation holes and provides an adequate level of EMI shielding with the antenna portion ventilation holes having the same thickness as the fan portion ventilation holes.