Chassis Wall Liquid Cooling Channel for Heat Dissipation
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Solution Overview
Problem
Conventional liquid cooling systems for information handling systems occupy significant space, making it challenging to dissipate high heat generated by powerful computing components without increasing the chassis size, which is undesirable for compact designs.
Innovation Solution
An external chassis wall liquid cooling system is implemented, where a liquid cooling channel is defined within the chassis wall, allowing for the circulation of coolant to dissipate heat from components to ambient air, utilizing previously unused surface area for enhanced heat ejection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional liquid cooling systems are used within the housing, then heat dissipation capability is improved, but chassis size and volume increase significantly
Solution Approach 1:
The patent moves the liquid cooling system from the internal three-dimensional space to the external two-dimensional surface of the chassis. By defining liquid cooling channels within the chassis wall itself and using the external surface as a heat exchange surface, the system utilizes the chassis exterior as a radiator, thereby achieving high heat dissipation capability without increasing internal chassis volume.
2Power
If chassis size is increased to accommodate conventional cooling systems, then heat dissipation capacity increases, but system compactness deteriorates
Solution Approach 1:
The patent merges the chassis structure with the cooling system by integrating liquid cooling channels directly into the chassis wall. The chassis serves dual functions as both structural support and heat dissipation device, eliminating the need for separate cooling components that would increase system volume.
3Volume of stationary object
If conventional air cooling systems are used, then chassis size can be kept small, but heat dissipation capability for high-powered systems becomes insufficient
Solution Approach 1:
The patent employs liquid cooling (hydraulics) instead of air cooling (pneumatics) by circulating coolant through channels defined in the chassis wall. The liquid coolant efficiently absorbs heat from internal components and transfers it to the external environment through the chassis wall, providing superior heat dissipation capability for high-powered systems within a compact form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly increases the ability to dissipate heat from the chassis to ambient air, allowing for efficient cooling of high-powered systems without the need for significant chassis size increases, with experimental results showing up to 320 watts of additional cooling capacity using fin-enhanced surfaces.
Implementation Method 1
a liquid cooling channel defined by the chassis wall and extending through the chassis wall between the first surface and the second surface
Implementation Method 2
configured to move that liquid through liquid conduits such that the liquid flows by heat producing components that heat up the liquid, as well as by air cooling systems (e.g., fans operated to move air by the liquid conduits) to cool that liquid moving through the liquid conduit and dissipate the heat generated
Data Source
AI summary
An external chassis wall liquid cooling system includes a chassis defining a chassis housing. A chassis wall is located on the chassis and includes a first surface that is located adjacent the chassis housing and a second surface that is located opposite the chassis wall from the first surface and that provides an outer surface of the chassis. A liquid cooling channel is defined by the chassis wall and extends through the chassis wall between the first surface and the second surface. A liquid is located in the liquid cooling channel, and a pump is coupled to the liquid cooling channel and configured to move the liquid through the liquid cooling channel. A fan system in the chassis housing may move air past heat producing components to transfer heat produced by those heat producing components, and the liquid may further dissipate that heat out of the chassis.