Chassis Wall Passive Cooling for Thin Computing Systems
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Solution Overview
Problem
Information handling systems face challenges in cooling high-performance components due to increased heat generation, leading to thickness increases and limitations in processor burst functionality, as existing cooling methods like heat pipes and fans struggle to dissipate heat efficiently.
Innovation Solution
A supplemental passive cooling system is implemented, where a heat transfer device engages both the heat-producing component and the chassis wall, transferring heat to the outer surface for dissipation, complementing primary active cooling through a forced convection device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat pipes or vapor chambers are used as heat transport mechanisms, then heat can be moved from heat-generating components to heat dissipation devices, but the system thickness increases due to required offsets from chassis walls
Solution Approach 1:
The patent combines the heat transport function with the chassis wall itself by integrating heat pipes directly into the chassis structure. The chassis wall serves dual purposes: structural support and heat conduction pathway. This eliminates the need for separate heat transport components and reduces system thickness while maintaining heat dissipation capability.
Solution Approach 2:
The chassis wall is designed to perform multiple functions simultaneously: providing structural integrity, serving as a thermal barrier for user comfort, and acting as a heat conduction pathway. By making the chassis wall multi-functional, the patent eliminates the need for additional dedicated heat transport components, thereby reducing overall system thickness.
2Object-affected harmful factors
If heat transport mechanisms are offset from chassis walls to prevent direct heat transfer, then user comfort is maintained, but the implementation of offsets increases system thickness
Solution Approach 1:
The patent applies different thermal properties to different regions of the chassis wall. The portion of the chassis wall that contacts the heat transport mechanism has high thermal conductivity for efficient heat removal, while the outer surface has controlled thermal properties to maintain user comfort. This localized differentiation allows the system to be thinner without compromising either heat dissipation or user comfort.
3Power
If forced convection devices and heat dissipation devices are used as the sole cooling means, then heat can be dissipated from components, but the cooling capability is insufficient for high-performance processors with burst functionality
Solution Approach 1:
The patent merges passive heat conduction through the chassis wall with active forced convection cooling. The heat pipe integrated into the chassis wall provides continuous passive heat transport, while the fan provides active air flow. This combination creates a hybrid cooling system that can handle the thermal loads of high-performance processors with burst functionality, overcoming the limitations of forced convection alone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances cooling efficiency, enabling increased processor operations, reducing the need for larger thermal dissipation devices, and allowing for smaller, cost-effective cooling solutions while maintaining user comfort by preventing direct heat transfer to the chassis surface.
Implementation Method 1
the engagement of the heat producing component, the heat transfer device, and the first chassis wall provides for the transfer of heat from the heat producing component, through the heat transfer device, and through the first chassis wall to the first chassis outer surface
Implementation Method 2
a forced convection device that is located in the first chassis housing adjacent the heat dissipation structure, wherein the forced convection device is configured to generate an airflow past the heat dissipation structure and out of the first chassis through the heat dissipation aperture
Data Source
AI summary
A cooling system includes a chassis defining a housing and including a wall having an outer surface. A computing device is located in the housing. A heat transfer device located in the housing engages the computing device and the wall, providing for heat transfer from the computing device, through the heat transfer device, and through the wall to the outer surface to produce supplemental passive cooling of the computing device via the outer surface. A heat dissipation aperture is defined by the chassis, and a heat dissipation device located in the housing adjacent the heat dissipation aperture engages the heat transfer device, which provides for heat transfer from the heat transfer device to the heat dissipation device. A forced convection device located in the housing generates an airflow past the heat dissipation structure and through the heat dissipation aperture to enable primary active cooling of the computing device.