Chassis Waveguide Interconnects for Shorter Server Blade Signal Paths
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Solution Overview
Problem
Rack servers and high-performance computers face signal loss and degradation due to long electrical signal paths through motherboard interconnects and cables, leading to complex layouts and increased bandwidth demands.
Innovation Solution
Implementing within-chassis waveguide structures that provide ultra-high-speed signal links between stacked platforms, reducing signal pathway length and complexity while increasing bandwidth density and reducing losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If motherboard interconnects and cables are used for signaling between boards, then signal transmission is achieved, but signal loss and degradation occur due to long signal paths
Solution Approach 1:
The patent transitions from traditional planar motherboard interconnects to three-dimensional waveguide structures that extend vertically between stacked platforms. This dimensional change enables shorter signal paths by utilizing the vertical stacking architecture, thereby reducing signal loss and degradation while maintaining reliable signal transmission between boards
2Productivity
If traditional cable-based interconnects are used, then signal transmission is achieved, but bandwidth density is limited and losses increase
Solution Approach 1:
The patent replaces traditional mechanical cable-based interconnects with electromagnetic waveguide structures. This substitution enables higher bandwidth density through multiple waveguide modes and frequencies, while simultaneously reducing signal losses by eliminating the limitations of physical cable transmissions and utilizing confined electromagnetic field propagation
3Reliability
If external high-speed cabling is used, then signal transmission is achieved, but system footprint increases and complexity increases
Solution Approach 1:
The patent merges the signal transmission function previously requiring external high-speed cabling into integrated waveguide structures that are incorporated within the chassis architecture. This consolidation eliminates the need for separate external cables and reduces system complexity by unifying the interconnect functionality within the platform stacking system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of waveguide interconnects enhances electrical performance, reduces system footprint, and eliminates the need for external high-speed cabling, resulting in improved signal quality and reduced complexity.
Implementation Method 1
waveguide interconnects that couple together a processor package and a memory package
Data Source
AI summary
Embodiments may relate an electronic device that includes a first server blade and a second server blade coupled with a chassis. The first and second server blades may include respective microelectronic packages. The electronic device may further include a waveguide coupled to the first and second server blades such that their respective microelectronic packages are communicatively coupled by the waveguide. Other embodiments may be described or claimed.