Reversible Chemical Handling of LEDs for Damage-Free Transfer
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Solution Overview
Problem
The transfer of light-emitting diodes between initial and screen substrates is complex and often results in diode deterioration, leading to black points on luminous display screens, and current repair methods are costly and tedious.
Innovation Solution
A handling member with reversible chemical interaction molecules that temporarily secure and release optoelectronic devices using chemical and/or physical treatments, such as light radiation, allowing for precise handling and separation without damaging the diodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If thermocompression technique is used to transfer diodes, then diodes can be transferred at very short distances, but diode deterioration occurs leading to black points
Solution Approach 1:
The patent replaces the mechanical thermocompression transfer system with a chemical bonding system using interaction molecules. The first interaction molecules on the handling member form reversible chemical bonds with second interaction molecules on the diodes, enabling transfer without mechanical pressure and heat that cause diode deterioration, while maintaining precise placement capability
Solution Approach 2:
The patent changes the bonding mechanism from mechanical/thermal to chemical. The reversible chemical interaction allows controlled bonding and release conditions, enabling precise transfer at room temperature without the high pressure and temperature of thermocompression, thus preventing diode damage while achieving accurate placement
2Reliability
If repair or change of defective diodes is performed, then number of black points is reduced, but additional manufacturing steps and costs increase
Solution Approach 1:
The patent applies preliminary action by using reversible chemical bonding that allows easy release and identification of defective diodes before final assembly. The handling member can selectively release diodes based on their functionality, enabling defect identification and sorting before transfer to the final substrate, thus preventing black points without requiring post-transfer repair operations
Solution Approach 2:
The system enables self-service by allowing defective diodes to be automatically identified and released through the reversible chemical interaction mechanism. Functional diodes remain bonded while defective ones can be selectively released and replaced, eliminating the need for complex manual repair processes and reducing overall manufacturing complexity
3Productivity
If mass transfer of diodes is performed, then production efficiency is improved, but damaged diodes are transferred forming black points
Solution Approach 1:
The patent introduces interaction molecules as an intermediary between the handling member and diodes. These molecules enable mass transfer through reversible chemical bonding, allowing efficient bulk handling while providing selective release capability. This intermediary mechanism permits high-speed transfer of large numbers of diodes while maintaining the ability to identify and release only defective units, preventing black points formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and cost-effective handling of optoelectronic devices by ensuring temporary securing and selective separation, reducing diode damage and manufacturing costs, and allowing for the identification of defective devices.
Implementation Method 1
a plurality of first interaction molecules capable of bonding to the contact surface, said first interaction molecules being intended to interact by reversible chemical interaction with a plurality of second interaction molecules capable of bonding to a functional surface of said at least one device electronic device
Implementation Method 2
the chemical interaction could also be broken by applying a chemical and/or physical treatment to molecules selected from the group comprising the plurality of first interaction molecules and the plurality of second interaction molecules, in a manner allowing separating said at least one electronic device and the handling member following the application of said chemical and/or physical treatment
Data Source
AI summary
The invention relates to a handling member (3) that is able to handle at least one electronic device (1), and to a method for handling such an electronic device (1) from a primary substrate (9). The handling method comprises: —a step (E3) of making the handling member (3) available; —a step (E4) of providing a primary substrate (9) on which the at least one electronic device (1) is disposed; —a step (E6) of temporarily securing the handling member (3) to the at least one electronic device (1); —a step (E9) of separating the handling member (3) and the at least one electronic device (1); —a step (E10) of withdrawing the handling member (3).