Chemical Discharge Nozzle Cleaning and Drying to Prevent Contamination
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Contamination during chemical discharge in semiconductor manufacturing processes, particularly due to scattering or rebounding from nozzles, affects the integrity of the etching and other substrate treatment processes.
Innovation Solution
A chemical discharge pipe system with a cover, buffer, and integrated cleaning and drying mechanisms using cleaning liquid and dry gas to clean and dry the nozzle tip, ensuring minimal contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a nozzle is used to discharge chemical, then chemical can be supplied to substrate, but contamination occurs due to scattering or rebounding in the nozzle
Solution Approach 1:
The patent applies preliminary action by introducing cleaning liquid and dry gas through the buffer before chemical discharge to prevent contamination. The buffer is pre-filled with cleaning liquid that flows outward to clean the chemical discharge pipe tip, and dry gas is supplied to dry the tip, preventing contamination before it occurs during chemical discharge.
Solution Approach 2:
The buffer acts as an intermediary between the cleaning liquid/dry gas suppliers and the chemical discharge pipe. It mediates the cleaning and drying processes by allowing cleaning liquid and dry gas to pass through it to reach the chemical discharge pipe tip, enabling indirect cleaning action that effectively removes contamination without direct contact.
2Reliability
If cleaning liquid is supplied to clean the chemical discharge pipe, then contamination is removed, but additional components and complexity are added to the system
Solution Approach 1:
The buffer serves multiple functions: it acts as a cleaning liquid reservoir, a cleaning liquid delivery mechanism, a dry gas passage, and a protective barrier. This multi-functionality reduces the need for separate dedicated components for each function, thereby reducing overall system complexity while maintaining effective cleaning capability.
Solution Approach 2:
The system enables self-service cleaning where the cleaning liquid and dry gas are automatically supplied through the buffer to clean and dry the chemical discharge pipe tip without requiring external manual intervention. The buffer structure itself facilitates the cleaning process, reducing the need for additional complex cleaning mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents process contamination by effectively cleaning and drying the chemical discharge pipe, maintaining process integrity and reducing the risk of chemical residue and scattering.
Implementation Method 1
The supplied cleaning liquid is sprayed by passing through the buffer via a space between the outside of the chemical discharge pipe and the inside of the cover to clean a tip of the chemical discharge pipe
Implementation Method 2
the supplied dry gas is sprayed by passing through the buffer via the space between the outside of the chemical discharge pipe and the inside of the cover to dry the tip of the chemical discharge pipe
Data Source
AI summary
The present disclosure provides an apparatus for treating a substrate, comprising: a chemical discharge pipe; a cover configured to surround the chemical discharge pipe; a buffer disposed in a space between the chemical discharge pipe and the cover; a chemical supplier configured to supply a chemical to the chemical discharge pipe; a cleaning liquid supplier configured to supply a cleaning liquid via the cover; and a dry gas supplier configured to supply a dry gas via the cover, wherein the supplied cleaning liquid is sprayed by passing through the buffer via a space between the outside of the chemical discharge pipe and the inside of the cover to clean a tip of the chemical discharge pipe, and the supplied dry gas is sprayed by passing through the buffer via the space between the outside of the chemical discharge pipe and the inside of the cover to dry the tip of the chemical discharge pipe.