Chemical Liquid Supply Apparatus In-Line Mixer for Semiconductor Etching
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Solution Overview
Problem
Single wafer type semiconductor processing apparatuses have lower productivity compared to batch type processing apparatuses, leading to inefficiencies in chemical liquid usage and substrate processing due to limitations in process capabilities.
Innovation Solution
A chemical liquid supply apparatus with a nozzle unit, chemical liquid supply unit, and mixer unit that combines high-temperature chemical liquids like phosphoric acid and fluorine-based etchants, along with silicon-based additives, to enhance etching efficiency and productivity by maintaining stable chemical compositions and temperatures through an in-line mixer and mixer pipe system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If single wafer type processing apparatus is used instead of batch type processing apparatus, then process capabilities are improved (avoiding dispersion defects and desiccation defects), but productivity decreases
Solution Approach 1:
The patent implements continuous circulation of chemical liquids through the substrate via pumps and circulation lines, maintaining continuous chemical action on the substrate surface. This continuous processing approach enables single wafer type apparatus to achieve productivity comparable to batch type while maintaining process quality, resolving the contradiction between reliability and productivity
2Productivity
If high-temperature chemical liquids are used to improve etching efficiency, then etch rate increases, but control of chemical reactions becomes more difficult
Solution Approach 1:
The patent incorporates temperature sensors in the chemical liquid supply lines and uses controllers to regulate heating elements, creating a feedback control system. This allows precise maintenance of high temperatures (e.g., 80-100°C for phosphoric acid) needed for high etch rates while automatically adjusting to maintain stability, thus improving etch rate without excessively increasing control complexity
Solution Approach 2:
The patent systematically varies chemical liquid parameters including temperature (heating to 80-100°C), concentration (e.g., 80% phosphoric acid), and flow rate (controlled by pumps) to optimize etching performance. By carefully controlling these parameters, high etch rates are achieved while maintaining reaction stability through defined parameter ranges
3Productivity
If multiple chemical liquids are mixed to enhance etching performance, then etching efficiency improves, but manufacturing precision of mixing system increases complexity
Solution Approach 1:
The patent uses separate tanks for different chemical liquids (phosphoric acid in one tank, fluorine-based etchant in another) with individual supply lines and pumps. This segmentation allows independent control and preparation of each chemical, simplifying the manufacturing of the mixing system while enabling complex multi-chemical processing through coordinated operation of separate components
Solution Approach 2:
The patent introduces a circulation line as an intermediary medium that transports chemical liquids from separate supply tanks to the substrate processing area. This intermediary system enables mixing and coordinated delivery of multiple chemicals without requiring direct integration of all supply systems, reducing manufacturing complexity while maintaining etching efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the etch rate and uniformity of silicon nitride processing, reduces processing time, and increases productivity by stabilizing chemical reactions and preventing excessive etching of silicon oxide layers, thus addressing the productivity gap between single wafer and batch type processing.
Implementation Method 1
an in-line mixer configured to mix the first chemical liquid and the second chemical liquid continually injected from the chemical liquid supply unit
Implementation Method 2
a heating unit provided in the chemical liquid supply apparatus and configured to heat the chemical liquid
Implementation Method 3
a pump configured to supply the first chemical liquid and the second chemical liquid to the mixer unit
Data Source
AI summary
A chemical liquid supply apparatus includes a nozzle unit including a nozzle arm and an injection nozzle mounted in an end of the nozzle arm, a chemical liquid supply unit including a first chemical liquid tank accommodating a first chemical liquid and a second chemical liquid tank accommodating a second chemical liquid, and supplying the first chemical liquid and the second chemical liquid to the nozzle unit, and a mixer unit provided in the nozzle unit and discharging a process fluid by mixing the first chemical liquid and the second chemical liquid, wherein the mixer unit includes an in-line mixer mixing the first chemical liquid and the second chemical liquid that are continually injected from the chemical liquid supply unit, and a mixer pipe extending from the in-line mixer to the injection nozzle.