Chevron Interconnect for Fine Pitch Probing

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Solution Overview

Problem

Current probe cards face challenges in meeting the stringent demands of smaller pitch requirements due to shrinking bump dimensions, requiring high-density probe arrays with sub-40 micron probe pitches, while maintaining electrical and mechanical integrity, and addressing issues of radial positional errors, planarity, and excessive scrub distances.

Innovation Solution

The development of non-linear, short, robust probe wires with chevron or curved shapes, engineered to minimize lateral scrub and optimize electrical resistance, contact force, and overdrive, using techniques such as MEMS or microfabrication to fabricate high-density arrays with precise alignment and planarity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If traditional straight probe wires are used, then manufacturing is simpler, but radial positional errors and scrub distances increase at sub-40 micron pitches

Engineering Contradiction:

Improveradial positional errorVSAvoidprobe wire geometry

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies curvature to probe wires by forming them in chevron or curved shapes rather than straight configurations. This curvature allows the probe tip to maintain better alignment with the contact bump center, reducing radial positional errors and scrub distances while accommodating sub-40 micron pitch requirements

Inventive Principle:

Principle #14Spheroidality (Curvature)

2Productivity

If probe pitch is reduced to meet smaller bump dimensions, then probing capability improves, but electrical resistance and contact reliability deteriorate

Engineering Contradiction:

Improveprobing densityVSAvoidcontact reliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent changes geometric parameters of the probe wire including forming chevron shapes with specific angles, optimizing wire diameter, and adjusting overall dimensions to maintain low electrical resistance and high contact reliability even at reduced pitch dimensions

Inventive Principle:

Principle #35Parameter changes

3Length of moving object

If longer probe wires are used, then reach and coverage improve, but scrub distance and lateral displacement increase

Engineering Contradiction:

Improveprobe wire lengthVSAvoidscrub distance

Core Design Contradiction:

Length of moving objectVSObject-generated harmful factors

Solution Approach 1:

The chevron and curved shapes create a non-linear path that absorbs lateral displacement forces, converting them into beneficial elastic deformation. This reduces the scrub distance at the contact point while maintaining the necessary probe length for reaching contact bumps

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The curved geometry introduces dynamic compliance to the probe wire, allowing it to flex and absorb lateral forces during contact establishment, thereby reducing scrub distance and improving contact precision

Inventive Principle:

Principle #15Dynamics

Data Source

PatentUS12032002B2Chevron interconnect for very fine pitch probing

Publication Date: 2024.07.09 INTEL CORP

AI summary

An apparatus an apparatus comprising: a substrate having a plane; and an array of at least one conductive probe having a base affixed to the substrate, the at least one conductive probe having a major axis extending from the plane of the substrate and terminating at a tip, wherein the one or more conductive probes comprise at least three points that are non-collinear.