Temperature-Responsive Chill Plate Supports for Substrate Cooling

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Solution Overview

Problem

Existing substrate treating apparatuses face challenges in optimizing both cooling efficiency and transfer speed, as large gaps reduce cooling efficiency while small gaps risk substrate damage due to the squeeze effect during substrate transfer.

Innovation Solution

A substrate treating apparatus with a chill plate featuring adjustable support parts, including first and second support parts with varying heights based on temperature, to support the substrate efficiently during cooling and transfer, using bimetals or ball plungers to adjust height according to temperature changes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If a large gap between the chill plate and substrate is used, then transfer speed is improved, but cooling efficiency deteriorates

Engineering Contradiction:

Improvetransfer speedVSAvoidcooling efficiency

Core Design Contradiction:

SpeedVSTemperature

Solution Approach 1:

The patent introduces an intermediary support structure (support protrusions or support plates) between the chill plate and substrate. These intermediaries maintain a specific gap distance that allows both efficient cooling and rapid transfer by preventing direct contact while ensuring adequate thermal coupling and avoiding squeeze effects during transfer.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the gap parameter dynamically or selectively based on operational requirements. By adjusting the gap distance between the chill plate and substrate through adjustable support structures, the system optimizes the balance between cooling efficiency (requiring smaller gap) and transfer speed (requiring larger gap).

Inventive Principle:

Principle #35Parameter changes

2Temperature

If a small gap between the chill plate and substrate is used, then cooling efficiency is improved, but substrate damage risk increases due to squeeze effect

Engineering Contradiction:

Improvecooling efficiencyVSAvoidsubstrate damage

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The support protrusions or support plates act as intermediaries that prevent direct contact between the substrate and chill plate during transfer operations. This intermediary structure eliminates the squeeze effect that would otherwise cause substrate damage, while still maintaining sufficient thermal coupling for effective cooling.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs support structures positioned beforehand to cushion and protect the substrate from potential damage during transfer. These support protrusions or plates are strategically placed to bear the substrate weight and prevent excessive pressure or contact forces that could cause damage.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Device complexity

If fixed support structure is used, then device complexity is reduced, but adaptability deteriorates

Engineering Contradiction:

Improvesupport structure complexityVSAvoidgap adjustment capability

Core Design Contradiction:

Device complexityVSAdaptability or versatility

Solution Approach 1:

The patent transitions from a fixed support structure to a dynamic, adjustable support system. The support protrusions or support plates can be adjusted in height or position to accommodate different substrate types, sizes, and cooling requirements, providing versatility without significantly increasing overall system complexity.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The adjustable support structures allow changing of the gap parameter to adapt to different operational conditions and substrate requirements. This parameter adjustability enhances the system's versatility for handling various substrate types while maintaining a relatively simple overall device architecture.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances cooling efficiency and prevents substrate damage during transfer by optimizing support height adjustments based on temperature, ensuring efficient and safe handling of substrates.

Implementation Method 1

a second support part including a bimetal installed on the chill plate and having flatness or a bending direction changed according to a temperature

Methodology Applied

Scientific EffectBimetallic strip effect: Bi-Metallic Strip

Implementation Method 2

a heating unit positioned at a second position and including a heating plate heating the substrate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

a cooling unit positioned at a first position and including a cooling plate cooling a substrate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12593658B2Substrate treating apparatus

Publication Date: 2026.03.31 SYSTEM ENGINEERING MEGA SOLUTION CO LTD

AI summary

A substrate treating apparatus includes: a chill plate; a first support part installed on the chill plate and including a first tip having a first height; and a second support part installed on the chill plate and having a height changed according to a temperature, wherein at a first temperature, a maximum height of the second support part becomes equal to or lower than a height of the first tip, such that the substrate is supported by the first tip of the first support part, and at a second temperature lower than the first temperature, the second support part becomes higher than the first tip, such that the substrate is supported by the second support part.