Semiconductor Chilling Plate Heat Dissipation for Rapid Temperature Switching
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Solution Overview
Problem
Existing devices for cold compress and hot compress suffer from cumbersome and inefficient temperature switching, particularly when transitioning from hot to cold, resulting in significant energy loss due to heat exchange inefficiencies in external pipelines.
Innovation Solution
A device incorporating a semiconductor chilling plate within a compress bag, a cooling medium circulation device, and a secondary heat dissipation system, including a radiator and fan, allows for rapid temperature adjustments by directly dissipating heat through a circulating cooling medium, ensuring efficient heat exchange and temperature balance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional external pipeline cooling is used to switch from hot compress to cold compress, then cooling function is achieved, but heat exchange efficiency decreases and energy loss increases
Solution Approach 1:
The invention extracts the cooling function from external pipelines and integrates it directly into the compress bag through internal circulation passages. The cooling medium circulation device with passages formed in the compress bag allows direct heat exchange with the semiconductor chilling plate, eliminating the need for external pipelines and the associated heat loss.
Solution Approach 2:
The circulation passages are nested within the compress bag structure, adjacent to the semiconductor chilling plate. This nested arrangement allows the cooling medium to flow directly through the bag, maximizing heat exchange efficiency while maintaining a compact integrated design.
2Temperature
If cooling water is cooled in advance and transferred through external pipelines, then cold compress is achieved, but heat exchange efficiency weakens due to external heat exchange
Solution Approach 1:
The cooling medium acts as an intermediary substance that circulates internally within the compress bag. Instead of relying on external pipeline heat exchange, the cooling medium directly contacts the semiconductor chilling plate through the internal circulation passages, enabling rapid and efficient heat transfer without external interference.
3Use of energy by moving object
If semiconductor chilling plate is directly disposed on working surface, then heat exchange efficiency improves, but temperature balance between two ends may be affected
Solution Approach 1:
The circulation passages are positioned adjacent to the semiconductor chilling plate to ensure continuous heat exchange between the cooling medium and the plate. This continuous internal circulation maintains temperature balance across the plate while maximizing heat exchange efficiency with the working surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables rapid and efficient temperature adjustments on the compress bag's surface, improving heat exchange efficiency and preventing temperature imbalances between the semiconductor chilling plate's ends, thus enhancing user experience and energy utilization.
Implementation Method 1
the compress bag includes a semiconductor chilling plate and a working surface for being attached to a human body, and the semiconductor chilling plate is disposed on the working surface
Implementation Method 2
the cooling medium circulation device includes a circulation passage and a cooling medium in the circulation passage, and the circulation passage is formed in the compress bag and is adjacent to one side, away from the working surface, of the semiconductor chilling plate
Implementation Method 3
the secondary heat dissipation device includes a radiator and a heat dissipation fan, the cooling medium flows through the radiator, and the radiator is disposed on an air outlet path of the heat dissipation fan
Data Source
AI summary
A device for cold compress and hot compress includes a compress bag, a control device, and a heat dissipation device. The compress bag includes a semiconductor chilling plate and a working surface, and the semiconductor chilling plate is disposed on the working surface; and the heat dissipation device includes a cooling medium circulation device, the cooling medium circulation device includes a circulation passage and a cooling medium, and the circulation passage is formed in the compress bag and is adjacent to one side, away from the working surface, of the semiconductor chilling plate. Through rapid cooling and heating of the semiconductor chilling plate, temperature adjustment on the working surface of the compress bag is achieved to meet the demand for cold compress and hot compress of a user; the semiconductor chilling plate is directly disposed on the working surface of the compress bag.