Chimney-Effect Heat Sink for LED Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current LED lamps face challenges in efficiently removing high heat while maintaining optical, mechanical, and aesthetic criteria, leading to reduced luminous flux and shortened LED life due to inadequate cooling capacity and inefficient heat sink designs.
Innovation Solution
A lighting apparatus with a heat sink featuring a center passageway and internal/external fins that utilize natural convection through a 'chimney effect' to efficiently cool LEDs, phosphor, and driver circuits, combined with an optimized optical structure and sensing capabilities for data collection and control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If high-output LED lamps are used to generate high luminous flux, then light output is improved, but heat generation increases and cooling capacity becomes insufficient
Solution Approach 1:
The patent transitions from traditional two-dimensional fin structures to a three-dimensional integrated heat sink design with multiple cooling channels and surfaces. The heat sink incorporates vertical fins, horizontal cooling channels, and multi-level heat dissipation surfaces that utilize spatial volume rather than just surface area, enabling more efficient heat removal from high-power LED lamps.
Solution Approach 2:
The heat sink is designed to perform multiple functions simultaneously: it provides structural support for the LED lamp components, serves as a heat dissipation device through its fin structures, acts as a light reflector to improve luminous flux distribution, and functions as a mounting platform for the LED chips and other components. This multi-functional integration resolves the contradiction by making the heat sink the central component that addresses both thermal management and optical performance.
2Temperature
If heat sink size is increased to improve cooling capacity, then heat removal is improved, but device size and weight constraints are violated
Solution Approach 1:
The heat sink employs local quality optimization by concentrating heat dissipation structures in areas of highest thermal demand. The design features denser fin spacing and larger surface area near the LED chip mounting locations where heat generation is most intense, while reducing material usage in areas with lower thermal loads. This localized approach maximizes cooling efficiency per unit weight.
Solution Approach 2:
The patent utilizes composite material construction for the heat sink, combining materials with different thermal and mechanical properties. The heat sink may incorporate aluminum or copper base materials with high thermal conductivity, combined with optimized fin structures and surface treatments that enhance heat dissipation while controlling weight. This composite approach allows achieving high cooling capacity without excessive weight increase.
3Use of energy by moving object
If passive cooling is used to avoid external energy consumption, then energy efficiency is improved, but heat sink size must increase to maintain cooling capacity
Solution Approach 1:
The heat sink design incorporates pneumatic principles by utilizing natural convection currents and air flow through the fin structures. The vertical fin arrangements and channel configurations are designed to promote buoyancy-driven air flow that enhances heat removal without requiring external fans or active cooling devices. This passive pneumatic approach maintains energy efficiency while optimizing the use of available heat sink volume.
4Ease of manufacture
If traditional heat sink designs are used, then manufacturing is simple, but optical performance and thermal management are insufficient
Solution Approach 1:
The patent merges the optical and thermal management functions into a single integrated heat sink structure. The heat sink incorporates optical elements such as reflective surfaces and light-guiding features directly into its thermal management geometry. This merging allows the same component to simultaneously optimize both heat removal and light output, achieving improved optical performance without requiring separate optical components that would complicate manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced cooling efficiency, maintains LED temperature within safe limits, increases luminous flux, and extends LED life while maintaining a compact form factor, integrating thermal and optical optimization with sensing and data sharing features.
Implementation Method 1
Heat removal is performed by firstly transmitting heat to heat sink fins from a heat source and then, by means of convection and radiation, transmitting heat into the air through the fins
Implementation Method 2
Heat removal is performed by firstly transmitting heat to heat sink fins from a heat source and then, by means of convection and radiation, transmitting heat into the air through the fins
Implementation Method 3
A lighting apparatus with a heat sink featuring a center passageway and internal/external fins that utilize natural convection through a 'chimney effect' to efficiently cool LEDs, phosphor, and driver circuits
Data Source
AI summary
A lighting apparatus and system and method for controlled lighting are provided. In one embodiment, a lighting apparatus comprises a heat sink including a center passageway passing from a chimney inlet to a driver circuit housing, a plurality of internal heat sink fins within the center passageway, and a plurality of external heat sink fins adjacent the driver circuit housing. A flow channel is between each set of two adjacent heat sink fins of the plurality of heat sink fins to provide a plurality of internal inlet flow channels and a plurality of external outlet flow channels, with each flow channel aligned with one of a plurality of PCBs, each having an LED mounted thereon.