Semiconductor Chip Adhesive Layout to Prevent Package Bleeding
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Solution Overview
Problem
The occurrence of adhesive bleeding, which is the spreading and flowing out of adhesive, is a problematic issue in semiconductor packages where a semiconductor chip is disposed on a substrate using an adhesive.
Innovation Solution
A semiconductor device is designed with a solder resist or epoxy ink disposed on the substrate surface to contact at least a part of the adhesive, ensuring its thickness is greater than or equal to the adhesive, thereby preventing adhesive bleeding and stress relief between the semiconductor chip and the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is applied to bond semiconductor chip to substrate, then bonding strength is improved, but adhesive bleeding occurs causing spreading and flowing out of adhesive
Solution Approach 1:
A third substance (solder resist or epoxy ink) is introduced as an intermediary between the adhesive and the substrate surface. This intermediary layer contacts the adhesive and prevents it from spreading and flowing out, while allowing the adhesive to maintain its bonding function. The solder resist or epoxy ink acts as a barrier that confines the adhesive within desired boundaries.
Solution Approach 2:
The solder resist or epoxy ink is applied locally at specific positions on the substrate where adhesive bleeding is problematic. This creates different functional zones: areas with solder resist/epoxy ink that prevent bleeding, and areas without it that allow bonding. The local application targets the harmful effect without compromising the overall bonding strength.
2Object-generated harmful factors
If solder resist or epoxy ink is added to prevent adhesive bleeding, then adhesive bleeding is prevented, but device complexity increases
Solution Approach 1:
The solder resist or epoxy ink serves multiple functions simultaneously: it prevents adhesive bleeding, provides electrical insulation, and can contribute to the overall structural integrity of the package. By making this component multi-functional, the need for additional separate elements is reduced, thereby limiting the increase in device complexity.
Solution Approach 2:
The function of preventing adhesive bleeding is merged with the existing solder resist or epoxy ink that is already part of the semiconductor packaging process. Instead of adding a completely new component, the invention combines the bleeding prevention function with an existing material layer, thereby minimizing the increase in device complexity.
Data Source
AI summary
A semiconductor device includes a substrate having a first surface, a first adhesive disposed on the first surface, and a first semiconductor chip disposed on the first adhesive. The semiconductor device further includes a first insulating member disposed on the first surface so as to be in contact with at least a part of the first adhesive. In a first direction perpendicular to the first surface, an upper surface of the first insulating member is higher than or equal to an upper surface of the first adhesive.