Semiconductor Chip Air Exhaust Passages for Void-Free Bonding
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Solution Overview
Problem
Air trapped between semiconductor substrates and chips during bonding processes weakens adhesive force and reduces productivity due to void formation, which existing technologies have not effectively addressed.
Innovation Solution
Incorporating air exhaust passages with a larger outlet area than inlet area on semiconductor chips and substrates to create a pressure difference, allowing trapped air to be expelled outside the package, thereby enhancing adhesion between the substrate and chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional bonding process is used to mount semiconductor chip on substrate, then bonding process is simple, but air trapped between substrate and chip generates voids that weaken adhesive force and reduce productivity
Solution Approach 1:
The patent extracts the harmful trapped air from the bonding interface by introducing air exhaust passages that extend from the bonding interface to the outer surface of the semiconductor chip. These passages provide a dedicated pathway for air to escape during the bonding process, preventing void formation and maintaining strong adhesive force between the substrate and chip.
Solution Approach 2:
The air exhaust passages are segmented into multiple distributed channels across the bonding interface area. This segmentation allows air to be exhausted from multiple locations simultaneously, improving air removal efficiency and ensuring uniform bonding across the entire chip-substrate interface.
2Reliability
If air exhaust passages are added to remove trapped air, then adhesive force is improved, but device structure becomes more complex
Solution Approach 1:
The air exhaust passages are localized to specific regions where air trapping is most problematic, rather than uniformly distributing them across the entire chip. The passages are concentrated at the bonding interface and edge regions, providing targeted air removal while minimizing the overall structural modification and maintaining local bonding quality.
3Productivity
If air exhaust passages with larger outlet area are used to create pressure difference, then air removal efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The air exhaust passages are designed with varying cross-sectional areas along their length, with the outlet area at the bonding interface being larger than the inlet area at the outer surface. This parameter change creates a pressure difference that drives air flow during bonding, improving air removal efficiency. The gradual transition in area helps manage manufacturing tolerances while maintaining effective air exhaust functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The air exhaust passages effectively remove trapped air, improving the adhesive force between semiconductor substrates and chips, leading to enhanced productivity and package reliability.
Implementation Method 1
The first passage area of the inlet and the second passage area of the outlet may generate a pressure difference in the air exhaust passages. The air trapped inside the semiconductor package may be exhausted to the outside along the air exhaust passage by the pressure difference.
Data Source
AI summary
A semiconductor package includes a semiconductor substrate and a semiconductor chip in contact with the semiconductor substrate. The semiconductor chip has a first surface facing the semiconductor substrate and an opposite second surface. The semiconductor chip has a die region, an edge region extending around the die region and a plurality of air exhaust passages extending from the die region to an outer surface of the edge region in the first surface of the semiconductor chip. Each of the air exhaust passages includes an inlet having a first passage area, and an outlet having a second passage area greater than the first passage area.