Chip Alignment Imaging for Precise Component Mounting
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Solution Overview
Problem
Existing component mounting systems face challenges in achieving high positional precision due to temporal changes in alignment marks caused by vibration and thermal expansion, which affect the accuracy of positional deviation calculations.
Innovation Solution
A component mounting system that simultaneously images multiple alignment marks using an imaging device, with the marks separated by a preset distance within the depth-of-field range, allowing for real-time calculation and correction of positional deviations between the component and substrate, thereby reducing the influence of temporal changes and thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple pairs of alignment marks are imaged in sequence, then the positional deviation amount can be recognized, but temporal changes in alignment mark positions due to vibration, camera movement, or thermal expansion affect measurement precision
Solution Approach 1:
The patent combines multiple imaging operations into a single simultaneous imaging operation. By capturing images of multiple alignment mark pairs at the same time rather than sequentially, the system eliminates temporal changes between measurements while maintaining the ability to recognize positional deviation amounts across multiple marks.
Solution Approach 2:
The patent transitions from sequential temporal imaging to simultaneous spatial imaging. By arranging multiple alignment mark pairs in the visual field and imaging them concurrently, the system adds a spatial dimension to the measurement process, allowing multiple measurements to be taken at once without temporal separation.
2Manufacturing precision
If alignment marks are imaged sequentially, then all marks can be captured, but vibration and thermal expansion cause positional changes that reduce manufacturing precision
Solution Approach 1:
The patent merges multiple imaging functions into a single imaging operation. By capturing all alignment mark pairs simultaneously in one shot, the system eliminates the need for repeated imaging and the associated temporal errors from vibration and thermal expansion, thereby improving manufacturing precision.
Solution Approach 2:
The patent creates a single comprehensive copy of all alignment marks in one imaging operation. Instead of taking multiple separate images sequentially, the system captures a complete snapshot of all alignment marks at once, preserving their positions at a single moment in time and eliminating errors from temporal changes.
3Measurement precision
If the substrate and component are close together for imaging, then alignment marks are clearly visible, but the depth of field may not accommodate both marks simultaneously
Solution Approach 1:
The patent changes the imaging parameters, specifically the depth of field settings, to accommodate the spatial separation between the substrate and component. By adjusting the depth of field to be equal to or greater than the distance separating the two objects, the system can image both alignment marks simultaneously at the same focal plane, maintaining measurement precision without requiring the objects to be in close proximity.
Data Source
AI summary
This chip mounting system simultaneously images an alignment mark disposed on a substrate (WT) and an alignment mark disposed on a chip (CP), with the alignment marks disposed on the substrate (WT) and the chip (CP) being separated by a first distance at which the alignment marks fall within a depth-of-field range of imaging devices. The chip mounting system calculates a relative positional deviation amount between the substrate (WT) and the chip (CP) from the imaged images of the alignment marks imaged by the imaging devices and, based on the calculated positional deviation amount, relatively moves the chip (CP) with respect to the substrate (WT) in a direction in which the positional deviation amount therebetween decreases.