Chip Component Alignment via Wettability-Zoned Substrate

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing methods for aligning chip components with substrates using liquids face challenges in achieving high accuracy due to positional deviations caused by capillary forces, especially when the components and substrates have rectangular shapes extending in one direction.

Innovation Solution

The method involves creating a substrate with a mounting region divided into lyophilic and lyophobic regions, where the lyophilic region is symmetrically arranged and supplied with liquid, reducing liquid seepage and tilting, and ensuring the chip component's surface has matching regions for improved alignment accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If liquid is supplied to the entire mounting region to achieve alignment, then the chip component can be positioned on the substrate, but liquid seeps out from the sides causing positional deviation and reducing alignment accuracy

Engineering Contradiction:
Improvealignment accuracyVSAvoidliquid seepage
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The mounting region is divided into different wettability zones: a central lyophilic region that attracts and holds liquid to prevent seepage, and peripheral lyophobic regions that repel liquid. This local differentiation of surface properties allows the liquid to be contained within the mounting region without seeping out from the sides, thereby maintaining alignment accuracy.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The mounting region is segmented into multiple functional zones based on wettability characteristics. The lyophilic region is further divided into multiple partial regions arranged symmetrically, creating distinct liquid interaction zones that control liquid distribution and prevent uncontrolled seepage while maintaining proper chip alignment.

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If the mounting region has high wettability throughout to ensure liquid adhesion, then the chip component aligns well, but the liquid state cannot be maintained at temperatures above 100 degrees C

Engineering Contradiction:
Improvealignment accuracyVSAvoidtemperature range
Core Design Contradiction:
Manufacturing precisionVSTemperature

Solution Approach 1:

The surface energy parameters of different mounting region zones are adjusted to create distinct wettability characteristics. The lyophilic region has high surface energy for strong liquid adhesion at low temperatures, while the lyophobic regions have low surface energy to repel liquid. This parameter differentiation allows proper liquid containment and alignment at operating temperatures below 100 degrees C.

Inventive Principle:
Principle #35Parameter changes

3Shape

If the chip component and mounting region have rectangular shapes extending in one direction, then they match geometrically, but capillary forces cause positional deviation during alignment

Engineering Contradiction:
Improvegeometric matchingVSAvoidpositional accuracy
Core Design Contradiction:
ShapeVSManufacturing precision

Solution Approach 1:

While the overall chip and mounting region maintain rectangular geometric compatibility, the liquid distribution pattern is made asymmetric through the lyophilic/lyophobic zoning. The lyophilic region is positioned centrally with specific symmetry axes, creating a balanced capillary force distribution that counteracts the asymmetric rectangular geometry effects, thereby eliminating positional deviation during alignment.

Inventive Principle:
Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the alignment accuracy by balancing capillary forces and reducing positional deviations, allowing for precise chip component placement on the substrate.

Implementation Method 1

a chip component is arranged on the liquid, and the chip component is aligned with respect to the mounting region by virtue of a capillary force

Methodology Applied
Scientific EffectCapillary force: Capillary Action

Implementation Method 2

The seeping liquid generates a resistance force against a driving force (capillary force)

Methodology Applied
Scientific EffectCapillary force: Capillary Action

Data Source

PatentUS10553455B2Method for aligning chip components relative to substrate by using liquid
Publication Date: 2020.02.04 TOKYO ELECTRON LTD
  • US10553455B2 patent drawing
  • US10553455B2 patent drawing
  • US10553455B2 patent drawing

AI summary

A liquid is supplied to a substrate and a chip component is arranged on the liquid. The substrate includes a first surface in which a rectangular mounting region is formed. The chip component includes a second surface having a rectangular shape which substantially coincides with the shape of the mounting region, and has an area substantially equal to that of the mounting region. The mounting region includes first and second regions. Wettability of the first region with respect to the liquid is higher than that of the second region with respect to the liquid. The first region is provided symmetrically with respect to a first central line passing through the middle of a pair of long sides and a second central line passing through the middle of a pair of short sides in the mounting region, and includes rectangular partial regions. The liquid is supplied to the first region.