Chip Antenna Module Array for 5G mmWave Signal Loss Reduction
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Solution Overview
Problem
High-frequency millimeter wave communications, such as 5G, face signal loss due to easy absorption of RF signals, requiring specialized antenna configurations and integration with RFICs to maintain effective isotropic radiated power (EIRP) and gain.
Innovation Solution
A chip antenna module array with a connection member featuring wiring vias, feed lines, and chip antenna modules with specific dielectric layers and patterns, including a ceramic-based first patch antenna dielectric layer and a solder layer for reduced size and increased dielectric constant, along with a laminated feed line structure to minimize transmission loss and enhance radiation patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional antenna configurations are used for high frequency band communications, then the antenna can be simpler in structure, but signal loss increases due to easy absorption of RF signals
Solution Approach 1:
The patent combines the antenna structure with the RFIC substrate, integrating the feed network and grounding system directly into the antenna module. This merging of components reduces overall system complexity while improving signal efficiency through optimized electromagnetic coupling between the feed line and patch antenna elements.
Solution Approach 2:
The patent transitions from planar antenna designs to three-dimensional stacked patch antenna configurations with multiple dielectric layers. This dimensional change enables better control over radiation patterns and reduces signal loss by creating multiple radiation paths and improving impedance matching in the vertical dimension.
2Power
If additional power amplifier and integration are implemented to ensure antenna gain, then effective isotropic radiated power is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent integrates the power amplifier, feed network, and antenna elements into a single modular chip antenna module. This consolidation improves effective isotropic radiated power through optimized power distribution while reducing overall device complexity by eliminating separate mounting and interconnection requirements.
Solution Approach 2:
The RFIC substrate serves multiple functions simultaneously: it acts as the mounting platform for the antenna elements, provides the feed network transmission lines, offers grounding planes, and integrates the power amplifier circuitry. This multi-functionality reduces the number of separate components needed while maintaining high EIRP performance.
3Volume of moving object
If ceramic-based dielectric layers with high dielectric constant are used, then antenna size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent utilizes dielectric layers with specifically optimized thickness parameters and dielectric constants to achieve size reduction. By carefully controlling the electromagnetic properties and geometric dimensions of each layer, the antenna module achieves compact form factor while maintaining manufacturability through standard fabrication processes.
Solution Approach 2:
The patent employs composite dielectric structures combining multiple materials with different dielectric constants in a stacked configuration. This composite approach enables size reduction through effective electromagnetic field confinement while providing manufacturing tolerance through the distributed nature of the composite structure.
4Loss of energy
If laminated feed line structure is implemented to minimize transmission loss, then signal transmission efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges the feed line transmission structure with the grounding system through a laminated configuration where signal and ground planes are closely coupled. This integration minimizes transmission loss through reduced parasitic inductance and improved return path coupling, while the modular lamination approach keeps manufacturing complexity manageable.
Solution Approach 2:
The laminated feed line structure uses multiple dielectric layers with different properties to optimize signal transmission. Each layer is designed with specific dielectric constant and loss tangent values to minimize transmission loss at different frequency ranges, creating a composite transmission line structure that outperforms single-layer designs.
Data Source
AI summary
A chip antenna module array includes a connection member and chip antenna modules mounted on the connection member. Each chip antenna module includes: a first patch antenna dielectric layer; a feed via extending through the first patch antenna dielectric layer; and a patch antenna pattern disposed on an upper surface of the first patch antenna dielectric layer and configured to be fed from the feed via. At least one chip antenna module includes: a ground pattern disposed on a lower surface of the first patch antenna dielectric layer; a chip-antenna feed line including a second part disposed on a lower surface of the ground pattern, and electrically connecting a connection member feed line to the feed via; a first feed line dielectric layer disposed on a lower surface of the second part; and a solder layer disposed on a lower surface of the first feed line dielectric layer.