Chip Antenna With Ceramic Substrate For 5G Miniaturization
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Solution Overview
Problem
The challenge in 5G communication systems is the difficulty in using typical antennas in GHz bands due to the small wavelengths, which require a small-sized chip antenna module that can be mounted on mobile communication devices and operate effectively in high-frequency ranges without significant interference.
Innovation Solution
A chip antenna design featuring a first and second substrate with ceramic sintered material, including Mg2SiO4, MgAl2O4, and CaTiO3 phases, and a bonding layer with a lower dielectric constant, arranged to minimize interference and enhance radiation efficiency by adjusting the dielectric constant and spacing between substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If typical antennas are used in GHz bands, then communication functions can be provided, but the wavelength becomes very small (several millimeters) making it difficult to implement
Solution Approach 1:
The patent changes the dielectric constant parameter of the substrate material to enable miniaturization. By using a ceramic substrate with a high dielectric constant (7.5 to 15.6 at 28 GHz), the antenna can operate at GHz frequencies while maintaining a compact form factor suitable for mobile devices.
Solution Approach 2:
The patent employs a composite ceramic material comprising multiple phases (Mg2SiO4, MgAl2O4, and CaTiO3) to achieve the desired dielectric constant range. This composite structure allows optimization of electromagnetic properties while maintaining mechanical stability and small size for 5G band operation.
2Volume of moving object
If the dielectric constant of the substrate is increased to reduce antenna size, then miniaturization is achieved, but interference between antenna elements increases
Solution Approach 1:
The patent optimizes the dielectric constant within a specific range (7.5 to 15.6 at 28 GHz) rather than using extremely high values. This balanced parameter selection achieves miniaturization while controlling interference effects between antenna elements in the array configuration.
Solution Approach 2:
The patent applies different material compositions and structures to different regions of the antenna module. The ceramic substrate with controlled dielectric constant is used in specific areas to minimize interference between adjacent antenna elements while maintaining overall compact size.
3Reliability
If a bonding layer with lower dielectric constant is introduced between substrates, then interference is reduced and radiation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent introduces a bonding layer with lower dielectric constant as an intermediary between the ceramic substrates. This intermediate layer acts as a mediator to reduce electromagnetic interference and improve radiation efficiency by optimizing the field distribution between the antenna elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves reduced interference and improved radiation efficiency, allowing the chip antenna to operate effectively in high-frequency bands while minimizing size and interference, suitable for 5G communication systems.
Implementation Method 1
the first substrate may have a dielectric constant of 7.5 to 15.6 at 28 GHz
Implementation Method 2
a dielectric constant of the bonding layer is lower than a dielectric constant of the first substrate and a dielectric constant of the second substrate
Data Source
AI summary
A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.