Chip Antenna Module With Coupling Pattern For 5G Bandwidth
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Solution Overview
Problem
High-frequency millimeter wave communications, such as 5G, face challenges due to RF signal absorption, leading to reduced communication quality, which requires specialized antenna technologies to enhance gain and effective isotropic radiated power (EIRP).
Innovation Solution
A chip antenna module design featuring a dielectric layer with a high dielectric constant, a solder layer, patch antenna patterns, coupling patterns, and feed vias that optimize RF signal propagation and resonance, allowing for miniaturization and increased bandwidth through strategic placement and electromagnetic coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional antenna technology is used for high frequency bands, then device size can be maintained, but communication quality deteriorates due to RF signal absorption
Solution Approach 1:
The patent changes the dielectric constant parameter of the substrate material to enhance antenna gain and compensate for RF signal absorption in high frequency bands, thereby improving communication quality without increasing device size
Solution Approach 2:
The patent transitions from planar antenna patterns to three-dimensional stacked configurations with multiple dielectric layers and metal patterns at different heights, utilizing vertical space to achieve beamforming and enhanced gain while maintaining compact form factor
2Reliability
If antenna gain is enhanced through specialized technologies, then communication quality improves, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into a single integrated structure where the substrate serves as both mechanical support and dielectric resonator, feed patterns provide both signal distribution and impedance transformation, eliminating the need for separate components and reducing overall complexity
Solution Approach 2:
The metal patterns serve multiple functions simultaneously: they act as radiating elements, impedance transformation structures, and beamforming arrays, while the dielectric layers provide both mechanical support and electromagnetic resonance, reducing the number of dedicated components needed
3Power
If integrated antenna and RFIC are implemented, then effective isotropic radiated power increases, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the antenna system into modular stacked layers with standardized interfaces, allowing the RFIC and antenna patterns to be manufactured separately and then precisely aligned through the via structures, reducing overall integration precision requirements
Solution Approach 2:
The via structures serve as intermediary elements that provide both electrical connection and mechanical alignment references between the RFIC and antenna patterns, facilitating precise integration without requiring ultra-precise direct bonding
4Adaptability or versatility
If bandwidth is widened through strategic placement, then communication capability improves, but device size increases
Solution Approach 1:
The patent utilizes the vertical dimension by stacking multiple dielectric layers with metal patterns at different heights, creating a three-dimensional electromagnetic resonance structure that achieves wide bandwidth without increasing the planar footprint of the device
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves improved communication quality by enhancing antenna gain, reducing size, and widening bandwidth, effectively addressing the challenges of signal absorption in high-frequency bands.
Implementation Method 1
a coupling pattern disposed on the second surface of the first dielectric layer, and spaced apart from the patch antenna pattern without overlapping the patch antenna pattern in a thickness direction
Implementation Method 2
a first dielectric layer; a solder layer disposed on a first surface of the first dielectric layer
Data Source
AI summary
A chip antenna module includes a first dielectric layer; a solder layer disposed on a first surface of the first dielectric layer; a patch antenna pattern disposed on a second surface of the first dielectric layer; a coupling pattern disposed on the second surface of the first dielectric layer, and spaced apart from the patch antenna pattern without overlapping the patch antenna pattern in a thickness direction; a first feed via extending through the first dielectric layer in the thickness direction so as not to overlap the patch antenna pattern and the coupling pattern in the thickness direction; a first feed pattern extending from a first end of the first feed to overlap at least a portion of the coupling pattern; and a second feed pattern extending from a second end of the first feed via to overlap at least a portion of the coupling pattern.