Chip Antenna With 3D Dielectric-Conductor Layering
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Solution Overview
Problem
The challenge in 5G communications is the difficulty in using conventional antennas in GHz bands due to the small wavelengths, requiring a compact chip antenna module for mobile devices that can operate effectively in high frequency ranges like 3 GHz to 60 GHz.
Innovation Solution
A chip antenna design featuring a body portion with a radiating portion and a ground portion, where the radiating portion includes a dielectric substance and a conductor, allowing for adjustable thickness and placement to optimize resonance frequency and radiation efficiency, and can be mounted on various electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional antennas are used in GHz bands, then antenna performance may be adequate for lower frequencies, but the small wavelengths make it difficult to use conventional antenna designs and require compact sizes
Solution Approach 1:
The patent transitions from planar 2D antenna structures to 3D立体 structures by stacking multiple dielectric layers with conductive patterns on different planes. This vertical dimensionality change allows the antenna to achieve compact footprint while maintaining effective radiating area and controlling impedance, resolving the contradiction between small size and performance reliability in GHz bands.
Solution Approach 2:
The patent employs composite structures combining multiple dielectric materials with different permittivity values and conductive materials in a layered configuration. This composite approach enables precise control of electromagnetic field distribution, impedance matching, and resonance characteristics, achieving reliable antenna performance in compact form factors for 5G applications.
2Loss of energy
If the radiating portion includes both dielectric substance and conductor in different regions, then radiation efficiency is enhanced, but structural complexity increases
Solution Approach 1:
The patent merges the dielectric substrate and conductive patterns into an integrated radiating structure where the dielectric material itself becomes part of the radiating element. This consolidation eliminates the need for separate radiating components, reducing structural complexity while maintaining enhanced radiation efficiency through the distributed capacitance and inductance of the integrated structure.
3Adaptability or versatility
If multiple dielectric substances and conductors are used in the radiating portion, then bandwidth is expanded and resonance frequencies are tuned, but manufacturing complexity increases
Solution Approach 1:
The patent segments the antenna into multiple functional layers with different dielectric materials and conductive patterns, where each layer can be independently designed and optimized for specific frequency ranges. This segmentation enables broad bandwidth coverage and multiple resonance frequencies while facilitating modular manufacturing processes such as sequential lamination and printing, reducing overall manufacturing complexity despite the multi-material composition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances antenna radiation efficiency, allows for easier tuning of resonance frequencies, and expands bandwidth, improving gain and reducing interference, making it suitable for high-frequency wireless communications.
Implementation Method 1
allows for adjustable thickness and placement to optimize resonance frequency and radiation efficiency
Implementation Method 2
the radiating portion includes a dielectric substance and a conductor
Data Source
AI summary
A chip antenna includes: a body portion; a radiating portion disposed on one surface of the body portion in a width direction; and a ground portion disposed on another surface of the body portion in a width direction, wherein the radiating portion includes a dielectric substance and a conductor, and the dielectric substance and the conductor are respectively disposed in different regions in a thickness direction.