Chip Antenna with Fish Bone Structure for NFC Bandwidth

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Solution Overview

Problem

Existing chip antennas face challenges in achieving high bandwidth and efficiency due to power loss and size constraints, particularly in near field communication systems, where off-chip antennas are costly and bulky, and on-chip antennas suffer from reduced radiation efficiency and gain due to high dielectric constants and resistance.

Innovation Solution

A chip antenna design featuring a fish bone structured first antenna element and a dipole antenna element on a silicon substrate, with additional capacitance and inductance components, allowing for miniaturization and increased bandwidth by controlling the distance between metal wires and forming a low-velocity wave structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If an off-chip antenna is used, then radiation efficiency and gain are improved, but size and cost increase

Engineering Contradiction:
Improveradiation efficiencyVSAvoidantenna size
Core Design Contradiction:
Loss of energyVSVolume of moving object

Solution Approach 1:

The patent combines the antenna structure directly with the chip substrate, integrating the radiating elements into the chip itself rather than using a separate off-chip antenna. This merging approach maintains radiation efficiency while reducing overall size by eliminating the need for a separate antenna component.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The chip substrate serves multiple functions: it acts as both the circuit board for electronic components and the radiating structure for the antenna. This multi-functionality allows the same structure to provide both computational/electronic functions and radiation functions, improving efficiency without increasing size.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Volume of moving object

If an on-chip antenna is used, then size is reduced, but power loss increases due to high resistance and dielectric constant

Engineering Contradiction:
Improveantenna sizeVSAvoidpower loss
Core Design Contradiction:
Volume of moving objectVSLoss of energy

Solution Approach 1:

The patent applies different material properties and structural characteristics to different regions of the on-chip antenna. By optimizing the local geometry and material distribution, the design reduces power loss in specific high-resistance areas while maintaining the compact size advantage of on-chip integration.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The antenna structure utilizes composite construction with multiple metal layers and dielectric materials with different properties. This composite approach allows optimization of current distribution and reduces resistive losses by strategically placing conductive elements and selecting appropriate dielectric constants in different regions.

Inventive Principle:
Principle #40Composite materials

3Device complexity

If a general dipole antenna is used, then simplicity is maintained, but bandwidth is limited

Engineering Contradiction:
Improveantenna structure simplicityVSAvoidbandwidth
Core Design Contradiction:
Device complexityVSAdaptability or versatility

Solution Approach 1:

The dipole antenna is segmented into multiple sections with different geometries and dimensions. This segmentation allows each section to contribute to different frequency ranges, collectively providing broader bandwidth while maintaining the basic dipole configuration and relative structural simplicity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent extends the conventional two-dimensional dipole design by incorporating three-dimensional structural elements and multi-layer configurations. This dimensional enhancement provides additional degrees of freedom for impedance matching and resonance control, thereby increasing bandwidth without significantly complicating the overall structure.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS9755313B2Chip antenna for near field communication and method of manufacturing the same
Publication Date: 2017.09.05 SAMSUNG ELECTRONICS CO LTD
  • US9755313B2 patent drawing
  • US9755313B2 patent drawing
  • US9755313B2 patent drawing

AI summary

Provided are chip antennas for near field communication and methods of manufacturing the chip antennas. A chip antenna for near field communication includes a substrate; a first antenna element on the substrate; and a second antenna element on the first antenna element. The substrate, the first antenna element, and the second antenna element are included in a single chip. The first and second antenna elements are formed outside the chip. The substrate is a lower layer including a plurality of devices. The first antenna element is a metal structure having a fish bone shape. The second antenna element is a dipole antenna.