Chip Antenna Module Array for Millimeter Wave Signal Loss
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Solution Overview
Problem
Millimeter wave communications, such as 5G, face challenges with RF signal absorption and loss at high frequencies, requiring specialized antenna designs that differ from conventional antennas to maintain communication quality.
Innovation Solution
A chip antenna module array is developed with a configuration of first and second chip antenna modules, each with distinct resonant frequencies and dielectric layers, connected via a connection member, optimizing electromagnetic coupling and size reduction through different electromagnetic coupling directions and dielectric constants.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional antenna designs are used for millimeter wave communications, then the antenna structure is simple and easy to manufacture, but the RF signals are easily absorbed and lost resulting in poor communication quality
Solution Approach 1:
The antenna system is divided into multiple chip antenna modules, each with specific resonant frequencies, arranged in an array configuration. This segmentation allows each module to handle specific frequency bands independently, improving overall communication quality while maintaining manageable complexity through modular design
Solution Approach 2:
The patent transitions from planar antenna arrangements to three-dimensional stacked configurations with coupling patterns positioned at different vertical levels. This dimensional change enables better electromagnetic coupling and signal transmission for millimeter wave frequencies, addressing the absorption and loss issues without excessive complexity
2Reliability
If chip antenna modules with different resonant frequencies are arranged in an array, then the overall gain and bandwidth are improved, but the manufacturing precision requirements increase due to specific spacing and coupling requirements
Solution Approach 1:
The patent specifies particular parameter ranges for coupling pattern dimensions, spacing distances, and vertical level separations to optimize electromagnetic coupling between modules. By defining these parameters within specific ranges rather than exact values, the design achieves improved antenna performance while accommodating normal manufacturing tolerances
Solution Approach 2:
The antenna modules utilize dielectric layers with specific permittivity values and metal patterns with optimized thicknesses and conductivities. These composite material choices enhance the electromagnetic coupling efficiency between modules, improving overall performance while reducing sensitivity to dimensional variations
3Loss of energy
If the antenna modules are spaced apart on the connection member, then the electromagnetic coupling is optimized and signal loss is reduced, but the overall device size increases
Solution Approach 1:
The patent positions coupling patterns at different vertical levels (z-direction) rather than only horizontal separations. This three-dimensional arrangement optimizes electromagnetic coupling and reduces signal loss while maintaining a compact footprint, as the vertical stacking allows modules to be closer in the x-y plane without compromising performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances antenna performance by reducing the overall size while improving gain and bandwidth, effectively addressing the challenges of high-frequency signal absorption and loss in millimeter wave communications.
Implementation Method 1
optimizing electromagnetic coupling and size reduction through different electromagnetic coupling directions and dielectric constants
Implementation Method 2
each with distinct resonant frequencies and dielectric layers, connected via a connection member, optimizing electromagnetic coupling and size reduction through different electromagnetic coupling directions and dielectric constants
Implementation Method 3
a first patch antenna pattern disposed on an upper surface of the first dielectric layer, configured to be fed from the first feed via, and having a first resonant frequency
Data Source
AI summary
A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.