Chip Antenna Module with Varying Ceramic Substrate Thickness
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Solution Overview
Problem
The challenge in 5G communication systems is the difficulty in using existing antennas in the GHz band due to the reduced wavelength, which requires a compact chip antenna module with improved radiation efficiency and gain for mobile communication terminals.
Innovation Solution
A chip antenna module is designed with a structure comprising ceramic substrates of varying thicknesses and dielectric constants, where the first ceramic substrate is thicker than the second, and a bonding layer with a lower dielectric constant is used to reduce the overall dielectric constant, enhancing radiation efficiency and gain while minimizing size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If existing antennas are used in GHz band, then antenna structure is simple, but wavelength is reduced to several mm making it difficult to use
Solution Approach 1:
The patent changes the dielectric constant parameter by using a bonding layer with lower dielectric constant than the ceramic substrates. This parameter change increases the effective wavelength of RF signals in the antenna structure, making it feasible to use antennas in the GHz band where wavelength is reduced to several millimeters.
2Volume of moving object
If chip antenna module size is reduced, then miniaturization is achieved, but radiation efficiency and gain are reduced
Solution Approach 1:
The patent optimizes the thickness ratio between the first and second ceramic substrates (first substrate thickness is 2-3 times the second substrate thickness) and uses a bonding layer with lower dielectric constant. These parameter changes enable the antenna to maintain high radiation efficiency and gain while achieving miniaturization suitable for mobile communication terminals.
Solution Approach 2:
The patent uses a composite structure combining ceramic substrates with a bonding layer of different dielectric properties. This composite material approach allows the antenna to achieve both compact size and high radiation efficiency by leveraging the complementary properties of different materials in the GHz frequency range.
3Volume of moving object
If dielectric constant is increased, then antenna size is reduced, but overall dielectric constant increases reducing radiation efficiency
Solution Approach 1:
The patent applies local quality by using ceramic substrates with high dielectric constant for miniaturization while introducing a bonding layer with lower dielectric constant in specific regions. This local variation in dielectric properties allows the antenna to maintain compact size while preserving radiation efficiency by preventing excessive overall dielectric constant.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively miniaturizes the chip antenna module, increases the wavelength of RF signals, and reduces interference between adjacent antennas, improving radiation efficiency and gain, making it suitable for 5G communication systems.
Implementation Method 1
at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch
Implementation Method 2
a bonding layer disposed between the first ceramic substrate and the second ceramic substrate. A dielectric constant of the bonding layer may be lower than a dielectric constant of the first ceramic substrate and a dielectric constant of the second ceramic substrate
Data Source
AI summary
A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.