Chip Antenna Module Multi-Band Patch Design
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Solution Overview
Problem
High-frequency millimeter wave communications, such as 5G, face signal loss due to RF signal absorption, requiring specialized antenna technologies with additional power amplifiers and integration with RFICs to maintain communication quality.
Innovation Solution
A chip antenna module design featuring multiple patch antenna patterns with distinct frequency bands, feed vias, and shielding vias to enhance antenna performance and miniaturization, including a layered dielectric structure with varying dielectric constants and air cavities to improve signal transmission and reception.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional antenna technology is used for high frequency band communications, then device simplicity is maintained, but signal loss increases due to RF signal absorption
Solution Approach 1:
The antenna is divided into multiple patch antenna patterns (first patch antenna pattern and second patch antenna pattern) with different areas, allowing each patch to operate at different frequency bands. This segmentation enables multi-band operation while maintaining efficient signal transmission and reducing energy loss.
Solution Approach 2:
The patent transitions from conventional planar antenna designs to a three-dimensional stacked patch antenna structure. The first and second patch antenna patterns are positioned at different heights above the substrate, creating vertical dimensionality that enables multi-frequency operation and improves radiation efficiency in the high frequency band.
2Volume of moving object
If antenna size is reduced for miniaturization, then device compactness improves, but antenna gain decreases
Solution Approach 1:
The second patch antenna pattern is positioned within the projection area of the first patch antenna pattern, creating a nested configuration. This nesting allows both antenna elements to coexist in a compact space while maintaining their respective radiation characteristics and gain levels for different frequency bands.
Solution Approach 2:
By utilizing the vertical dimension to position patch antenna patterns at different heights, the design achieves multi-frequency operation without increasing the horizontal footprint. This three-dimensional arrangement enables miniaturization while preserving antenna gain through optimized spatial separation.
3Adaptability or versatility
If multiple frequency bands are supported, then communication versatility improves, but electromagnetic interference increases
Solution Approach 1:
Different patch antenna patterns are designed with specific area ratios and positioning optimized for their respective frequency bands. The first patch antenna pattern has a larger area for lower frequency bands, while the second patch antenna pattern has a smaller area for higher frequency bands, creating local quality variations that reduce mutual interference.
Solution Approach 2:
The patent employs feed vias with different impedance characteristics (first feed via and second feed via) that are optimized for specific frequency bands. These feed structures act as frequency-selective elements that allow signals in their designated bands while attenuating other frequencies, effectively filtering out electromagnetic interference.
Data Source
AI summary
A chip antenna module includes: a solder layer disposed on a lower surface of the first dielectric layer; a first patch antenna pattern disposed on upper surface of the first dielectric layer and having a through-hole; a second patch antenna pattern spaced apart from an upper surface of the first patch antenna pattern and having an area less than an area of the first patch antenna pattern; a first feed via extending through the first dielectric layer and electrically connected to the first patch antenna pattern; a second feed via extending through the first dielectric layer and the through-hole, and electrically connected to the second patch antenna pattern; and shielding vias extending through the first dielectric layer, electrically connected to the first patch antenna pattern, and at least partially surrounding the second feed via.