Chip Antenna Module With Stacked Ceramic Substrates
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Solution Overview
Problem
The challenge in using antennas in 5G communication systems is the difficulty in effectively transmitting and receiving radio-frequency signals due to the short wavelengths in GHz bands, leading to signal interference and reduced energy efficiency.
Innovation Solution
A chip antenna module is designed with a substrate and multiple chip antennas, where ceramic substrates are spaced apart with a bonding layer or spacer, and a ground layer is used to reflect signals, reducing interference and improving radiation efficiency by adjusting the dielectric constant and spacing between antennas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If chip antennas are placed close together to reduce module size, then area is reduced, but signal interference increases due to short wavelengths in 5G bands
Solution Approach 1:
The patent implements a nested structure where a first chip antenna is embedded within the substrate and a second chip antenna is positioned on top of the substrate, creating a three-dimensional stacked configuration. This vertical nesting allows multiple antennas to occupy a smaller horizontal footprint while maintaining sufficient separation to reduce signal interference between adjacent antennas.
Solution Approach 2:
The patent transitions from a two-dimensional planar arrangement of antennas to a three-dimensional stacked configuration by positioning antennas at different vertical levels (one embedded in substrate, one on top). This dimensional change enables closer packing in the horizontal plane while maintaining adequate spacing through vertical separation, thereby reducing interference.
2Reliability
If ceramic substrates are spaced apart to reduce interference, then signal quality improves, but device complexity increases due to additional spacers or bonding layers
Solution Approach 1:
The substrate serves multiple functions simultaneously: it acts as the mounting platform for the first chip antenna (embedded), provides structural support, and serves as the base for positioning the second chip antenna (on top). This multi-functionality reduces the need for additional dedicated spacing components, thereby maintaining signal quality while limiting complexity increase.
Solution Approach 2:
The substrate acts as an intermediary element between the two chip antennas, providing physical separation and positioning. By embedding one antenna within the substrate and mounting the other on top, the substrate itself becomes the spacing mechanism, eliminating the need for separate spacer components and simplifying the overall structure.
3Use of energy by moving object
If ground layer is added to reflect signals and improve radiation efficiency, then energy efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The ground layer is integrated directly into the substrate structure, merging the grounding function with the existing substrate fabrication process. This combination allows the ground layer to be formed simultaneously with the substrate layers during manufacturing, avoiding additional separate manufacturing steps and reducing overall complexity despite the added functional capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the radiation efficiency and gain of the chip antenna module, allowing it to effectively operate in 5G frequency bands with reduced interference and improved signal transmission.
Implementation Method 1
the substrate may include a ground layer configured to reflect the radio-frequency signal transmitted by each of the plurality of chip antennas in a target direction
Implementation Method 2
a bonding layer disposed between the first ceramic substrate and the second ceramic substrate to space the first ceramic substrate and the second ceramic substrate apart from each other
Data Source
AI summary
A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.