Chip Antenna Surface Pattern for Stronger Conductor Adhesion

Solution Overview

Problem

Current 5G communication systems require smaller, more efficient antenna solutions for mobile terminals to support higher frequency bandwidths and increased data transmission, while maintaining adhesion and horizontality, which is challenging due to the need for reduced size and increased antenna efficiency.

Innovation Solution

A chip antenna with a concavo-convex pattern on its substrate, featuring alternately disposed convex and concave portions, enhances adhesion by increasing the contact area and anchoring effect through a sintered conductor pattern, suitable for GHz bandwidths and installation in electronic devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the size of the antenna is reduced to fit mobile terminals, then the antenna can be installed in portable devices, but the antenna efficiency and adhesion are compromised

Engineering Contradiction:

Improveantenna sizeVSAvoidadhesion and antenna efficiency

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The substrate surface is designed with a concavo-convex pattern creating a porous-like structure that increases surface area and mechanical interlocking. The pattern includes convex portions protruding upward and concave portions recessed downward, forming a textured surface that enhances adhesion between the substrate and conductor pattern while maintaining a compact overall antenna size

Inventive Principle:

Principle #31Porous materials

Solution Approach 2:

The invention transitions from a flat two-dimensional substrate surface to a three-dimensional concavo-convex surface. By adding vertical dimension through convex and concave portions, the antenna achieves improved adhesion and electrical performance without increasing the horizontal footprint, thus maintaining small size while improving reliability

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If a flat substrate surface is used, then the manufacturing is simpler, but the adhesion between substrate and conductor pattern is insufficient

Engineering Contradiction:

Improvesubstrate fabrication simplicityVSAvoidadhesion between substrate and conductor pattern

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The substrate surface is designed with a concavo-convex pattern creating a porous-like structure that increases surface area and mechanical interlocking. The pattern includes convex portions protruding upward and concave portions recessed downward, forming a textured surface that enhances adhesion between the substrate and conductor pattern

Inventive Principle:

Principle #31Porous materials

Solution Approach 2:

The substrate surface features curved convex and concave portions rather than sharp edges. The convex portions have rounded tops and the concave portions have smooth transitions, creating a continuously varying surface profile that improves mechanical interlocking and adhesion strength while remaining manufacturable

Inventive Principle:

Principle #14Spheroidality (Curvature)

3Strength

If the contact area between substrate and conductor pattern is increased, then adhesion is improved, but the antenna size increases

Engineering Contradiction:

ImproveadhesionVSAvoidantenna size

Core Design Contradiction:

StrengthVSVolume of moving object

Solution Approach 1:

The invention transitions from a flat two-dimensional substrate surface to a three-dimensional concavo-convex surface. By adding vertical dimension through convex and concave portions, the antenna achieves improved adhesion and electrical performance without increasing the horizontal footprint, thus maintaining small size while improving reliability

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The substrate surface is designed with a concavo-convex pattern creating a porous-like structure that increases surface area and mechanical interlocking. The pattern includes convex portions protruding upward and concave portions recessed downward, forming a textured surface that enhances adhesion between the substrate and conductor pattern

Inventive Principle:

Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The chip antenna design improves adhesion between the ceramic substrate and metal conductor pattern, maintaining horizontality and efficiency, enabling effective RF signal transmission and reception in high-frequency bandwidths, suitable for portable devices and drones.

Implementation Method 1

a convex portion extending in one direction and a concave portion extending in one direction are alternately disposed in the concavo-convex pattern

Methodology Applied

Scientific EffectMechanical interlocking:

Implementation Method 2

enhances adhesion by increasing the contact area and anchoring effect through a sintered conductor pattern

Methodology Applied

Scientific EffectSintering: Sintering

Data Source

PatentUS11749875B2Chip antenna and manufacturing method thereof

Publication Date: 2023.09.05 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

A chip antenna includes a substrate having a concavo-convex pattern on a surface thereof, and a conductor pattern disposed on the surface of the substrate having the concavo-convex pattern, wherein a convex portion extending in one direction and a concave portion extending in one direction are alternately disposed in the concavo-convex pattern.