Chip Antenna Through-Hole Structure for Stable High-Yield Manufacturing
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Solution Overview
Problem
The manufacturing process of existing chip antennas is unstable, leading to a high defect rate and material waste, which increases costs and reduces yield.
Innovation Solution
A method involving a substrate with metal layers, electroplating, and specific hole patterns to form a conductive layer, followed by circuit formation, solder masking, and electrode layer creation, with precise cutting to produce a stable and efficient chip antenna structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If printing technology, lithography, and wet etching technology are used to form the radiator, then the volume of the chip antenna is reduced, but the manufacturing process stability deteriorates and defect rate increases
Solution Approach 1:
The patent replaces the traditional printing technology, lithography, and wet etching processes with a laser direct writing process. This substitution eliminates the need for masks, chemicals, and multiple processing steps, thereby improving manufacturing stability and reducing defect rates while maintaining the compact chip antenna volume.
Solution Approach 2:
The patent changes the manufacturing approach from conventional multi-step processes to laser direct writing with controlled parameters (laser power, scanning speed, hatch spacing). By optimizing these parameters, the process achieves both compact antenna formation and high manufacturing reliability.
2Ease of manufacture
If printing technology, lithography, and wet etching technology are used to form the radiator, then the chip antenna can be manufactured, but material waste increases and manufacturing costs increase
Solution Approach 1:
The laser direct writing process eliminates the need for physical masks and chemical etchants used in traditional lithography and wet etching. This substitution directly reduces material waste from masks, chemicals, and etching byproducts while maintaining ease of manufacture through a streamlined digital process.
Solution Approach 2:
The patent eliminates the need to discard masks and chemical materials by using a digital laser writing process. The entire manufacturing process becomes more efficient with no consumable materials to waste, directly reducing both material loss and associated disposal costs.
3Productivity
If conventional manufacturing processes are used, then the chip antenna can be produced, but the defect rate increases and manufacturing yield decreases
Solution Approach 1:
By replacing conventional manufacturing processes with laser direct writing, the patent eliminates multiple potential failure points including mask alignment errors, chemical contamination, and etching variability. This substitution directly improves both process stability and manufacturing yield.
Solution Approach 2:
The laser direct writing process is self-aligning and self-correcting, requiring no external mask alignment or chemical processing monitoring. This self-service capability reduces human intervention and potential errors, thereby improving both reliability and productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the stability and yield of chip antenna production, reduces material waste, and simplifies the manufacturing process, resulting in a more cost-effective and efficient antenna design.
Implementation Method 1
Electroplating a metal material on the metal layer of a front surface and a back surface of the substrate, and on walls of the external through holes and the internal through holes, to form a conductive layer
Data Source
AI summary
A method of manufacturing chip antenna and a structure of the chip antenna. The method includes the following steps: preparing a substrate, drilling a plurality of rows of external through holes and internal through holes arranged longitudinally, forming fishing grooves at the predetermined distance between every two of the internal through holes arranged longitudinally, electroplating a metal material on the external through holes and the internal through holes, to form a conductive layer. Afterward, a circuit layer is formed on the conductive layer by exposure, development, and etching techniques. An ink is printed on the substrate after the circuit layer finished, and the ink cover parts of the circuit layer and parts of the substrate exposed, to form a solder mask and a recognition pattern layer. Finally, a longitudinal cutting line and a horizontal cutting line are cut on the substrate, and to form a chip antenna.