Chip Antenna Vertical Embedding in Circuit Board
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Solution Overview
Problem
The existing antenna structures face challenges with the chip antenna being difficult to arrange due to increased height and susceptibility to separation or damage from external forces, especially in limited spaces, due to soldering issues and poor connections.
Innovation Solution
The antenna structure is redesigned to have the chip antenna pass through the circuit board vertically, with a joint hole and conductive layer connection, allowing for secure electrical fixation and reduced height, facilitating easier arrangement and use in electronic products.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the chip antenna is soldered to the circuit board through solder, then the chip antenna can be electrically connected to the circuit board, but the height of the chip antenna standing upright on the circuit board increases, making it difficult to arrange in limited spaces
Solution Approach 1:
The patent transitions from vertical soldering (adding height in the Z-dimension) to horizontal embedding (using the X-Y plane of the circuit board). The chip antenna is inserted through a joint hole and fixed laterally, changing the connection dimension from vertical to horizontal, thus reducing the height while maintaining electrical connection.
Solution Approach 2:
The chip antenna is nested within the circuit board structure by inserting it through a joint hole. The antenna is embedded in the circuit board rather than standing externally, similar to how a nested doll places one object inside another, reducing the external height while maintaining the connection.
2Reliability
If the chip antenna is soldered to the circuit board, then electrical connection can be achieved, but the chip antenna and circuit board are easy to be separated or fall off when affected by external forces
Solution Approach 1:
The patent combines multiple fixation methods (embedding in joint hole, adhesive bonding, and electrical soldering) into a unified connection structure. This merging of mechanical and electrical connections creates a composite joint that resists external forces better than soldering alone, preventing separation while maintaining electrical connectivity.
Solution Approach 2:
The patent applies adhesive bonding before soldering to create a preliminary mechanical bond that cushions against external forces. This prior cushioning prevents the chip antenna from falling off during the soldering process and under subsequent external stresses, ensuring both mechanical strength and electrical connection.
3Reliability
If soldering is used to connect the chip antenna to the circuit board, then electrical connection can be achieved, but poor circuit connection (cold solder joint) occurs if the solder is not completely melted
Solution Approach 1:
The patent applies adhesive bonding before soldering to create a preliminary mechanical bond. This cushioning effect supports the chip antenna during the soldering process, allowing more time for the solder to melt and flow properly without the risk of the component falling off, thereby reducing cold solder joints and improving manufacturing reliability.
Solution Approach 2:
The adhesive acts as an intermediary between the chip antenna and the circuit board, providing mechanical support during the soldering process. This mediator allows the soldering to proceed without the urgency caused by gravitational forces, ensuring complete melting and proper electrical connection while maintaining ease of manufacture.
Data Source
AI summary
An antenna-structure combination method includes following steps. Provide a circuit board. At least one joint hole penetrating the circuit board is formed in the circuit board. At least one electrode layer and one feeding line are formed on a periphery of the joint hole. The feeding line is electrically connected to the electrode layer. Provide a chip antenna. The chip antenna includes a base. The base has a wiring section. A fixed connection section is arranged at one end of the wiring section. The fixed connection section is formed with a conductive layer. The fixed connection section of the chip antenna penetrates the joint hole of the circuit board, so that the conductive layer is electrically fixed to the electrode layer, so that the chip antenna is fixedly connected onto the circuit board in an upright manner.