Chip Anti-Shake Camera Module With Integrated Substrate Wiring
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Solution Overview
Problem
Current chip-based anti-shaking mechanisms in camera apparatuses are limited by the large space occupation of flexible printed circuits, hindering further miniaturization and weight reduction.
Innovation Solution
A camera apparatus design featuring a lens, mounting frame, first and second driving members, and a photosensitive chip, with an anti-shaking driving mechanism using a substrate and elastic member to enable miniaturization and shake prevention, incorporating a substrate connected to a base via anti-shaking elastic members for controlled motion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flexible printed circuit (FPC) is used for connection and conduction of the chip, then electrical connection and signal transmission are achieved, but the space occupation increases and miniaturization is hindered
Solution Approach 1:
The patent merges the FPCB with the substrate, integrating the flexible printed circuit functionality directly into the substrate structure. This eliminates the need for a separate FPC component, reducing overall space occupation while maintaining electrical connection reliability for the chip-based anti-shaking mechanism
Solution Approach 2:
The substrate is designed to serve multiple functions: it acts as both the structural base for mounting the chip and the flexible printed circuit for electrical connections. This multi-functional design reduces the number of separate components needed, enabling miniaturization of the anti-shaking mechanism
2Weight of moving object
If the chip size is reduced for weight reduction, then power consumption decreases and anti-shaking performance improves, but the connection structure complexity increases
Solution Approach 1:
By integrating the FPCB functionality into the substrate, the patent reduces connection structure complexity. The merged design eliminates separate connection components and simplifies the overall structure, making it easier to accommodate smaller chips without proportionally increasing connection complexity
3Volume of moving object
If the anti-shaking mechanism is miniaturized, then weight reduction and integration improvement are achieved, but the connection and conduction space becomes insufficient
Solution Approach 1:
The integration of FPCB and substrate creates a compact unified structure that enables miniaturization of the anti-shaking mechanism. This merged design maintains ease of manufacture by reducing the number of assembly steps and components, while providing sufficient space for connections within the miniaturized volume
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves miniaturization and improved integration level while effectively preventing shake, reducing power consumption, and enabling stable motion control of the photosensitive chip.
Implementation Method 1
The substrate is movably connected to the base through the anti-shaking elastic member
Data Source
AI summary
A camera apparatus includes: a lens, a mounting frame, a first driving member, an anti-shaking driving mechanism, a second driving member, and a photosensitive chip. The lens penetrates the mounting frame. The first driving member is disposed on the mounting frame. The lens and the photosensitive chip are disposed sequentially in a direction of an optical axis of the lens. The anti-shaking driving mechanism includes a substrate, an anti-shaking elastic member, and a base. The substrate is movably connected to the base through the anti-shaking elastic member. Both the photosensitive chip and the second driving member are disposed on the substrate. Therefore, the first driving member is enabled to drive the substrate through the second driving member, thereby enabling the photosensitive chip to follow the substrate for anti-shaking motion.