Chip Assembly Asymmetric Contact for Imaging Device
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Solution Overview
Problem
Conventional imaging device chip assemblies face issues with contact portion short-circuiting due to dust, toner, or ink particles, as they are densely arranged on a limited surface area, making them prone to contamination and damage.
Innovation Solution
The chip assembly is designed with a configuration where contact portions are arranged asymmetrically on opposite sides of the substrate, with a conductor connecting the back contact portion to the stylus, allowing for stable electrical connection and reduced risk of short-circuiting by minimizing direct exposure to contaminants.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If contact portions are densely arranged on the substrate surface to maximize electrical connection capability, then the electrical connection capability is improved, but the risk of short-circuiting by dust/toner particles/ink increases
Solution Approach 1:
The patent transitions from a two-dimensional arrangement of all contact portions on one side of the substrate to a three-dimensional configuration where contact portions are distributed on opposite sides of the substrate. The front contact portions are arranged on one side to contact the stylus, while back contact portions are arranged on the other side and connected via conductors, effectively utilizing the substrate's thickness dimension to separate contact regions and reduce contamination risk.
Solution Approach 2:
The patent divides the contact portions into two distinct groups: front contact portions on one side of the substrate and back contact portions on the other side. This segmentation separates the contact regions physically, allowing the front contact portions to interface with the stylus while the back contact portions remain protected and connected through conductors, thereby reducing the likelihood of all contact portions being simultaneously contaminated.
2Object-affected harmful factors
If contact portions are arranged asymmetrically on opposite sides of the substrate, then contamination resistance is improved, but the device complexity increases due to additional conductor connections
Solution Approach 1:
The conductors in the patent serve multiple functions: they electrically connect the back contact portions to the front contact portions, provides mechanical support for the back contact portions, and help maintain the asymmetric arrangement of contact portions on opposite sides of the substrate. This multi-functionality reduces the need for additional separate components.
Data Source
AI summary
The provided are a chip assembly and an imaging material box. The chip assembly is configured to be installed in the imaging material box. The imaging material box is detachably installed on an imaging device provided with a stylus. The chip assembly includes a chip and a conductor. The chip includes a substrate and a plurality of contact portions arranged on the substrate. The plurality of contact portions include a front contact portion arranged on one side of the substrate and a back contact portion arranged on the other side of the substrate. In this way, the risk of the chip being short-circuited can be effectively reduced.